AMD Xilinx
XC6SLX150-L1FGG900C
XC6SLX150-L1FGG900C ECAD Model
XC6SLX150-L1FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 576 | |
| Number of Outputs | 576 | |
| Number of Logic Cells | 147443 | |
| Number of CLBs | 11519 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11519 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, LEAD FREE, BGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC6SLX150-L1FGG900C Datasheet Download
XC6SLX150-L1FGG900C Overview
The XC6SLX150-L1FGG900C chip model is a field programmable gate array (FPGA) developed by Xilinx, Inc. It is designed to be used in various applications, such as digital signal processing, embedded systems, and robotics. It is a cost-effective and high-performance device, which makes it an ideal choice for many industries.
The XC6SLX150-L1FGG900C chip model is equipped with a wide range of features and benefits that make it a great choice for various applications. It has a wide range of operating frequencies, ranging from 10MHz to 400MHz, and can be used for a variety of tasks, such as video processing, signal processing, and data acquisition. Furthermore, it has a low power consumption, making it an energy-efficient device. In addition, it has a high level of integration, meaning that it can be used to create complex designs without sacrificing performance.
The XC6SLX150-L1FGG900C chip model has been widely adopted in various industries, and its demand is expected to increase in the future. This is due to its low cost, high performance, and energy efficiency. Furthermore, its scalability and flexibility make it an ideal choice for a variety of applications, from embedded systems to robotics.
When it comes to the application of the XC6SLX150-L1FGG900C chip model in the development and popularization of future intelligent robots, it is a great choice. This is because it has the ability to process data quickly and accurately, and it is also highly integrated, meaning that it can be used to create complex designs without sacrificing performance. Furthermore, its scalability and flexibility make it an ideal choice for a variety of applications.
In order to use the XC6SLX150-L1FGG900C chip model effectively, a certain level of technical expertise is required. This includes knowledge of digital signal processing, embedded systems, and robotics. Furthermore, knowledge of FPGA programming and hardware design is also important. Additionally, it is also important to have a basic understanding of electrical engineering principles, such as circuit design, signal integrity, and power management.
In conclusion, the XC6SLX150-L1FGG900C chip model is a great choice for various industries, and its demand is expected to increase in the future. Furthermore, it is an ideal choice for developing and popularizing future intelligent robots, and it requires a certain level of technical expertise to use it effectively. Therefore, it is important to have a basic understanding of electrical engineering principles, as well as knowledge of digital signal processing, embedded systems, and robotics.
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