AMD Xilinx
XC5VTX150T-2FF1156I
XC5VTX150T-2FF1156I ECAD Model
XC5VTX150T-2FF1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 148480 | |
| Number of CLBs | 11600 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11600 CLBS | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC5VTX150T-2FF1156I Datasheet Download
XC5VTX150T-2FF1156I Overview
The XC5VTX150T-2FF1156I chip model is a powerful and versatile device designed to meet the needs of the most demanding applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. This chip model is optimized for use with the HDL language, making it easier for developers to create complex projects.
The XC5VTX150T-2FF1156I chip model offers several advantages over other models. It has a high-performance processor, a large amount of memory, and an array of interfaces. This makes it ideal for applications that require a great deal of processing power and memory. Additionally, the chip model is designed to be highly energy efficient, reducing the need for additional cooling solutions.
The XC5VTX150T-2FF1156I chip model is expected to be in high demand in the future, as more and more applications require its capabilities. It is likely to be used in a variety of industries, such as automotive, medical, and industrial applications. The chip model is also expected to be used in advanced communication systems, as its performance and energy efficiency make it an ideal choice for these types of applications.
The original design intention of the XC5VTX150T-2FF1156I chip model was to provide a powerful and efficient solution for a variety of tasks. It was designed to be highly energy efficient and easy to use, while still providing a great deal of power and memory. The chip model is also highly scalable, allowing it to be upgraded in the future as more advanced applications are developed. This makes it a great choice for developers who need a powerful and efficient solution for their projects.
The XC5VTX150T-2FF1156I chip model is an excellent choice for a variety of applications, and its expected demand in the future reflects its impressive capabilities. Its powerful processor, large amount of memory, and array of interfaces make it ideal for high-performance digital signal processing, embedded processing, image processing, and other related tasks. Additionally, its scalability and energy efficiency make it a great choice for advanced communication systems. With its impressive capabilities, the XC5VTX150T-2FF1156I chip model is sure to be in high demand in the coming years.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||