
AMD Xilinx
XC5VSX50T-3FF665I
XC5VSX50T-3FF665I ECAD Model
XC5VSX50T-3FF665I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | TIN LEAD | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5VSX50T-3FF665I Datasheet Download
XC5VSX50T-3FF665I Overview
XC5VSX50T-3FF665I is a chip model developed by Xilinx, a leader in programmable logic solutions. This model is designed for high-performance digital signal processing, embedded processing, image processing, and other advanced applications. It is built on Xilinx's Virtex-5 FPGA technology and is optimized for use in high-speed, low-power applications.
The XC5VSX50T-3FF665I chip model offers several advantages over traditional FPGA solutions. It provides a high level of performance and flexibility, allowing users to customize their applications to meet their specific needs. It also offers low power consumption, making it suitable for a wide range of applications. Additionally, the chip model is designed to be used with the HDL (Hardware Description Language) language, making it easier to program and debug.
The XC5VSX50T-3FF665I chip model is expected to be in high demand in the future, as more applications require high-performance digital signal processing and embedded processing. This chip model is also likely to be used in networks and intelligent systems, as it is designed to be used with HDL and is capable of handling complex tasks. Additionally, this chip model is expected to be used in the era of fully intelligent systems, as it is capable of handling a wide range of tasks and is designed to be used with HDL.
Overall, the XC5VSX50T-3FF665I chip model is an excellent choice for high-performance digital signal processing, embedded processing, image processing, and other advanced applications. It offers a high level of performance and flexibility, as well as low power consumption. Additionally, it is designed to be used with HDL, making it easier to program and debug. As a result, this chip model is expected to be in high demand in the future, as more applications require its capabilities. Furthermore, it is likely to be used in networks and intelligent systems, as well as in the era of fully intelligent systems.
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