XC5VLX50-3FF1153I
XC5VLX50-3FF1153I
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rohs

AMD Xilinx

XC5VLX50-3FF1153I


XC5VLX50-3FF1153I
F20-XC5VLX50-3FF1153I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
BGA1153

XC5VLX50-3FF1153I ECAD Model


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XC5VLX50-3FF1153I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 560
Number of Outputs 560
Number of Logic Cells 3600
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 710 MHz
Power Supplies 1,2.5 V
JESD-30 Code S-PBGA-B1153
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1153
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1153,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC5VLX50-3FF1153I Datasheet Download


XC5VLX50-3FF1153I Overview



The chip model XC5VLX50-3FF1153I is a new semiconductor chip developed by Xilinx, Inc. It is a low-power, high-performance FPGA (Field Programmable Gate Array) chip that is designed to be used in a variety of applications. This chip is designed to be used in a wide range of applications, including communications, video, and networking. It has a wide range of features that make it suitable for these applications.


The XC5VLX50-3FF1153I chip has several advantages that make it attractive for use in various industries. It is a low-power chip, making it suitable for applications that require low power consumption. It is also highly reliable, with a high-quality design that ensures that it is able to perform reliably in various conditions. The chip also features a high level of scalability, making it suitable for use in a wide range of applications.


The chip model XC5VLX50-3FF1153I is expected to be in high demand in the future, as it is suitable for a wide range of applications. It is expected to be used in many industries, including communications, video, and networking. It is also expected to be used in more advanced communication systems, as it is capable of providing high-speed data transfer and reliable performance.


The original design intention of the XC5VLX50-3FF1153I chip was to provide a low-power, high-performance chip for a wide range of applications. It is also capable of being upgraded in the future, making it suitable for use in more advanced applications. It is also possible for the chip to be used in advanced communication systems, as it is capable of providing high-speed data transfer and reliable performance.


The possible future applications of the XC5VLX50-3FF1153I chip are numerous. It is expected to be used in networks, as it is capable of providing high-speed data transfer and reliable performance. It is also expected to be used in intelligent scenarios, as it is capable of providing the necessary processing power and data transfer speeds. It is also possible for the chip to be used in the era of fully intelligent systems, as it is capable of providing the necessary processing power and data transfer speeds to support the development of such systems.


In conclusion, the XC5VLX50-3FF1153I chip is a low-power, high-performance FPGA chip that is designed to be used in a variety of applications. It has a wide range of features that make it suitable for these applications, and is expected to be in high demand in the future. It is also capable of being upgraded in the future, making it suitable for use in more advanced applications. It is also possible for the chip to be used in advanced communication systems, as well as in networks and intelligent scenarios. Finally, it is possible for the chip to be used in the era of fully intelligent systems, as it is capable of providing the necessary processing power and data transfer speeds.



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