
AMD Xilinx
XC5VLX50-3FF1153I
XC5VLX50-3FF1153I ECAD Model
XC5VLX50-3FF1153I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 560 | |
Number of Outputs | 560 | |
Number of Logic Cells | 3600 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 710 MHz | |
Power Supplies | 1,2.5 V | |
JESD-30 Code | S-PBGA-B1153 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1153 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1153,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5VLX50-3FF1153I Datasheet Download
XC5VLX50-3FF1153I Overview
The chip model XC5VLX50-3FF1153I is a new semiconductor chip developed by Xilinx, Inc. It is a low-power, high-performance FPGA (Field Programmable Gate Array) chip that is designed to be used in a variety of applications. This chip is designed to be used in a wide range of applications, including communications, video, and networking. It has a wide range of features that make it suitable for these applications.
The XC5VLX50-3FF1153I chip has several advantages that make it attractive for use in various industries. It is a low-power chip, making it suitable for applications that require low power consumption. It is also highly reliable, with a high-quality design that ensures that it is able to perform reliably in various conditions. The chip also features a high level of scalability, making it suitable for use in a wide range of applications.
The chip model XC5VLX50-3FF1153I is expected to be in high demand in the future, as it is suitable for a wide range of applications. It is expected to be used in many industries, including communications, video, and networking. It is also expected to be used in more advanced communication systems, as it is capable of providing high-speed data transfer and reliable performance.
The original design intention of the XC5VLX50-3FF1153I chip was to provide a low-power, high-performance chip for a wide range of applications. It is also capable of being upgraded in the future, making it suitable for use in more advanced applications. It is also possible for the chip to be used in advanced communication systems, as it is capable of providing high-speed data transfer and reliable performance.
The possible future applications of the XC5VLX50-3FF1153I chip are numerous. It is expected to be used in networks, as it is capable of providing high-speed data transfer and reliable performance. It is also expected to be used in intelligent scenarios, as it is capable of providing the necessary processing power and data transfer speeds. It is also possible for the chip to be used in the era of fully intelligent systems, as it is capable of providing the necessary processing power and data transfer speeds to support the development of such systems.
In conclusion, the XC5VLX50-3FF1153I chip is a low-power, high-performance FPGA chip that is designed to be used in a variety of applications. It has a wide range of features that make it suitable for these applications, and is expected to be in high demand in the future. It is also capable of being upgraded in the future, making it suitable for use in more advanced applications. It is also possible for the chip to be used in advanced communication systems, as well as in networks and intelligent scenarios. Finally, it is possible for the chip to be used in the era of fully intelligent systems, as it is capable of providing the necessary processing power and data transfer speeds.
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