AMD Xilinx
XC5VLX330T-3FF1738C
XC5VLX330T-3FF1738C ECAD Model
XC5VLX330T-3FF1738C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 960 | |
| Number of Outputs | 960 | |
| Number of Logic Cells | 331776 | |
| Number of CLBs | 25920 | |
| Combinatorial Delay of a CLB-Max | 670 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25920 CLBS | |
| Clock Frequency-Max | 550 MHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1738 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1738 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1738,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1738 | |
| Pin Count | 1738 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5VLX330T-3FF1738C Datasheet Download
XC5VLX330T-3FF1738C Overview
The XC5VLX330T-3FF1738C chip model is a powerful and versatile component, suitable for a wide range of applications. It is particularly well-suited for high-performance digital signal processing, embedded processing, and image processing. The chip requires the use of HDL language, making it a great choice for those who are familiar with programming and design.
The XC5VLX330T-3FF1738C chip model has a number of advantages that make it attractive for use in many industries. It has a high clock frequency, allowing for faster processing of data. It also has a large number of logic cells, allowing for more complex designs. The chip also has a low power consumption, making it ideal for use in battery powered devices. Additionally, the chip is highly reliable, with a low failure rate.
The demand for the XC5VLX330T-3FF1738C chip model is expected to grow in the future, as more industries begin to take advantage of its features. In the network industry, the chip could be used to provide faster speeds and better security. In the image processing sector, the chip could be used to create more detailed and accurate images. In the embedded processing sector, the chip could be used to create more efficient and powerful systems.
The XC5VLX330T-3FF1738C chip model could also be used in the era of fully intelligent systems. It could be used to create powerful and efficient systems that can process large amounts of data quickly. It could also be used to create systems that can learn from their environment and make decisions based on the data they receive. This could be especially useful in the field of robotics, where the chip could be used to create autonomous robots that can interact with their environment.
Overall, the XC5VLX330T-3FF1738C chip model is a powerful and versatile component that can be used in a variety of applications. Its high performance and low power consumption make it an attractive choice for many industries. Its potential applications in networks and intelligent systems make it an even more attractive choice for the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||