AMD Xilinx
XC5210-5TQ176C
XC5210-5TQ176C ECAD Model
XC5210-5TQ176C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 4.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-176 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-5TQ176C Datasheet Download
XC5210-5TQ176C Overview
The XC5210-5TQ176C chip model is a high-performance digital signal processing, embedded processing, and image processing chip developed by the renowned Xilinx Corporation. It is designed to meet the needs of high-performance computing and data processing, and it requires the use of HDL language. The chip model has a wide range of applications in various fields, including high-end communication systems, intelligent systems, and industrial automation.
The original design intention of the XC5210-5TQ176C chip model was to provide a powerful and efficient solution for high-performance computing and data processing. It is capable of handling complex tasks and can be used for a variety of applications. It also has the potential for future upgrades, making it a versatile and reliable chip for a wide range of applications.
The XC5210-5TQ176C chip model is particularly well-suited for advanced communication systems and networks. It is capable of providing high-speed data processing and can be used for a variety of tasks, such as high-speed transmission, data encryption, and network management. It is also capable of supporting a wide range of intelligent systems, such as artificial intelligence and machine learning.
The XC5210-5TQ176C chip model is also well-suited for the era of fully intelligent systems. It is capable of providing the necessary computing power to support the development of intelligent systems, such as autonomous vehicles, smart homes, and intelligent robots. With its powerful capabilities, the XC5210-5TQ176C chip model is well-suited for the development of advanced intelligent systems.
In conclusion, the XC5210-5TQ176C chip model is a powerful and efficient solution for high-performance computing and data processing. It is well-suited for advanced communication systems and networks, as well as for the development of intelligent systems. It is also capable of providing the necessary computing power to support the development of fully intelligent systems. The chip model is versatile and reliable, and has the potential for future upgrades, making it a great choice for a wide range of applications.
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