AMD Xilinx
XC5210-3TQ176I
XC5210-3TQ176I ECAD Model
XC5210-3TQ176I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | TYP. GATES = 10000-16000 | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-176 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3TQ176I Datasheet Download
XC5210-3TQ176I Overview
The XC5210-3TQ176I chip model was designed with the intention of providing a reliable and high-performance solution to the needs of modern communication systems. It is a high-performance, low-power, multi-core processor that is capable of supporting a wide range of applications and can be used in a variety of environments. The chip has been designed to be highly efficient, allowing it to be used in a wide range of applications, from industrial and automotive to consumer electronics.
The XC5210-3TQ176I chip model is capable of supporting advanced communications systems, making it an ideal choice for the development of next-generation networks. It is capable of supporting a variety of network topologies, including mesh, star, and hybrid networks, as well as a wide range of protocols, such as Wi-Fi, Bluetooth, and Zigbee. This makes it an ideal choice for the development of advanced communication systems.
The XC5210-3TQ176I chip model is also capable of being used in intelligent scenarios. It is capable of supporting a wide range of artificial intelligence (AI) applications, including natural language processing, machine learning, and computer vision. This makes it an ideal choice for the development of intelligent systems, such as robots, autonomous vehicles, and smart homes.
The XC5210-3TQ176I chip model is also capable of being used in the development and popularization of future intelligent robots. It is capable of supporting a wide range of robotics applications, including navigation, obstacle avoidance, and object recognition. This makes it an ideal choice for the development of robots that can interact with their environment and perform a variety of tasks.
In order to use the XC5210-3TQ176I chip model effectively, it is necessary to have a good understanding of the underlying technology and the different components that make up the chip. It is also important to have a good understanding of the different protocols and algorithms used in the development of intelligent systems. Additionally, it is important to have a good understanding of the different hardware components that are necessary for the development of robots, such as sensors, actuators, and controllers.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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