AMD Xilinx
XC5210-3TQ176C
XC5210-3TQ176C ECAD Model
XC5210-3TQ176C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-176 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5210-3TQ176C Datasheet Download
XC5210-3TQ176C Overview
The chip model XC5210-3TQ176C is the latest in a series of integrated circuits from Xilinx, one of the world's leading manufacturers of programmable logic devices. This model is designed to meet the demands of today's high-performance computing and communication applications. It features a high-performance, low-power, low-cost design that can be used in a variety of applications.
The XC5210-3TQ176C chip model has a number of advantages over other models. It is designed to be energy efficient, making it ideal for applications where power consumption is an issue. It also has a high level of integration, meaning that it can be used in a variety of applications without requiring additional components. In addition, it is designed to be highly scalable, allowing it to be used in a variety of applications and platforms.
The XC5210-3TQ176C chip model is expected to be in high demand in the future as more applications and platforms require high performance, low-power, and low-cost solutions. As the demand for these types of solutions increases, the XC5210-3TQ176C chip model will become increasingly popular. It is also likely to be used in a variety of communication systems, such as wireless networks, cellular networks, and satellite networks.
The original design intention of the XC5210-3TQ176C chip model was to provide a high-performance, low-power, low-cost solution for a variety of applications. It has been designed to be highly scalable, allowing it to be used in a variety of applications and platforms. In addition, it is designed to be energy efficient, making it ideal for applications where power consumption is an issue. It is also possible that the XC5210-3TQ176C chip model could be upgraded in the future to provide even higher performance and lower power consumption.
The XC5210-3TQ176C chip model has a number of potential applications in networks and intelligent scenarios. It can be used in wireless networks to provide high-speed data transfer, as well as in cellular networks to provide high-speed data transfer and voice services. It is also possible that it could be used in satellite networks to provide high-speed data transfer and voice services. In addition, it could be used in the era of fully intelligent systems to provide high-speed data transfer, as well as to provide intelligent features such as facial recognition and natural language processing.
Overall, the XC5210-3TQ176C chip model is an ideal solution for a variety of applications and platforms. It is designed to be energy efficient, highly scalable, and suitable for a variety of communication systems. It is expected to be in high demand in the future, and it is possible that it could be upgraded in the future to provide even higher performance and lower power consumption. In addition, it has a number of potential applications in networks and intelligent scenarios, making it a versatile solution for the future.
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