AMD Xilinx
XC5206-3TQ176I
XC5206-3TQ176I ECAD Model
XC5206-3TQ176I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 148 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 784 | |
| Number of Equivalent Gates | 6000 | |
| Number of CLBs | 196 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 6000 GATES | |
| Additional Feature | TYP. GATES = 6000-10000 | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-176 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC5206-3TQ176I Datasheet Download
XC5206-3TQ176I Overview
The XC5206-3TQ176I chip model is an integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is programmed in a hardware description language (HDL) and is suitable for a variety of applications.
The chip model XC5206-3TQ176I is a product of the ever-growing semiconductor industry. It is designed to meet the needs of a variety of applications and industries, including communications, consumer electronics, automotive, and more. As technology advances, so do the capabilities of this chip model. This means that it can be used in more advanced communication systems and can be upgraded in the future to meet the demands of new technologies.
The original design intention of the XC5206-3TQ176I chip model was to provide a powerful and reliable platform for digital signal processing, embedded processing, and image processing. It is capable of handling high-performance tasks and can be used in a variety of applications. It is also designed to be upgradeable, allowing it to keep up with the latest advancements in technology.
The XC5206-3TQ176I chip model is a testament to the ever-evolving semiconductor industry. As technology advances, so does the need for more powerful and reliable ICs. The XC5206-3TQ176I chip model is designed to meet the demands of the ever-changing industry and provide a platform for high-performance tasks. Its design allows for future upgrades and can be used in advanced communication systems. As the semiconductor industry continues to advance, the XC5206-3TQ176I chip model will continue to be a reliable and powerful platform for digital signal processing, embedded processing, and image processing.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||