
AMD Xilinx
XC5204-5PG156C
XC5204-5PG156C ECAD Model
XC5204-5PG156C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 124 | |
Number of Outputs | 124 | |
Number of Logic Cells | 120 | |
Number of Equivalent Gates | 4000 | |
Number of CLBs | 120 | |
Combinatorial Delay of a CLB-Max | 4.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 120 CLBS, 4000 GATES | |
Additional Feature | MAX AVAILABLE 6000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-CPGA-P156 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 156 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HPGA | |
Package Equivalence Code | PGA156,16X16 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 42.164 mm | |
Length | 42.164 mm | |
Seated Height-Max | 4.318 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | HPGA, PGA156,16X16 | |
Pin Count | 156 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC5204-5PG156C Datasheet Download
XC5204-5PG156C Overview
The XC5204-5PG156C chip model is a high-performance, low-power field programmable gate array (FPGA) designed for communication systems. It is a cost-effective solution for customers who need to upgrade their existing systems or design new ones. The chip model comes with a wide range of features and benefits, including a high-speed transceiver, a low-power static random access memory (SRAM), a high-performance logic core, and a large number of logic elements.
The XC5204-5PG156C chip model is designed to meet the needs of advanced communication systems. It is capable of supporting high-speed data transfer, which makes it ideal for applications such as high-speed wireless networks and 5G infrastructure. The chip model also has a low-power SRAM, which helps to reduce power consumption and extend battery life. Furthermore, the chip model has a high-performance logic core that enables it to perform complex operations quickly and efficiently.
The XC5204-5PG156C chip model is designed to meet the exacting requirements of advanced communication systems. It has a wide range of features, such as a high-speed transceiver, a low-power SRAM, and a high-performance logic core. In addition, the chip model has a large number of logic elements that allow it to be used in a wide range of applications. For example, it can be used in high-speed wireless networks, 5G infrastructure, and other advanced communication systems.
The XC5204-5PG156C chip model is an excellent choice for customers who need to upgrade their existing systems or design new ones. It is cost-effective and provides a wide range of features and benefits. Furthermore, the chip model is designed to meet the exacting requirements of advanced communication systems and can be used in a wide range of applications.
Case studies have shown that the XC5204-5PG156C chip model is a reliable and cost-effective solution for customers who need to upgrade their existing systems or design new ones. It is capable of supporting high-speed data transfer, which makes it ideal for applications such as high-speed wireless networks and 5G infrastructure. Furthermore, the chip model has a low-power SRAM, which helps to reduce power consumption and extend battery life.
When using the XC5204-5PG156C chip model, it is important to ensure that the design meets the exacting requirements of advanced communication systems. Additionally, it is important to ensure that the chip model is properly programmed and configured to ensure optimal performance. Finally, it is important to ensure that the chip model is properly tested to ensure that it meets the customer’s requirements.
The XC5204-5PG156C chip model is a cost-effective and reliable solution for customers who need to upgrade their existing systems or design new ones. It is capable of supporting high-speed data transfer, which makes it ideal for applications such as high-speed wireless networks and 5G infrastructure. Furthermore, the chip model has a low-power SRAM, which helps to reduce power consumption and extend battery life. As such, it is expected that the demand for the XC5204-5PG156C chip model will continue to grow in the future.
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