AMD Xilinx
XC5202-6PG156C
XC5202-6PG156C ECAD Model
XC5202-6PG156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 84 | |
| Number of Outputs | 84 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P156 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 156 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA156,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA156,16X16 | |
| Pin Count | 156 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5202-6PG156C Datasheet Download
XC5202-6PG156C Overview
The XC5202-6PG156C chip model is a powerful and versatile model that is suitable for a wide range of applications. Developed by Xilinx, it is a high-performance digital signal processing (DSP) device that is capable of embedded processing and image processing. To use this model, one must be proficient in the HDL (Hardware Description Language) language.
The design intention of the XC5202-6PG156C chip model was to provide a high-performance DSP device for a wide range of applications. It is designed to be highly scalable and can be easily upgraded for future applications. This makes it an ideal choice for any digital processing system that requires a powerful, yet flexible solution.
The XC5202-6PG156C chip model can be applied to advanced communication systems, such as networks and intelligent systems. The chip is capable of handling complex data processing tasks, making it suitable for a wide range of applications. In addition, the chip can be used in the era of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML). This makes the chip model an ideal choice for any system that requires complex data processing capabilities.
In conclusion, the XC5202-6PG156C chip model is a powerful and versatile model that is suitable for a wide range of applications. It is designed to be highly scalable and can be easily upgraded for future applications. It is capable of handling complex data processing tasks, making it suitable for advanced communication systems, networks, and intelligent systems. The chip model is an ideal choice for any system that requires complex data processing capabilities.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||