
AMD Xilinx
XC5202-3VQ64C
XC5202-3VQ64C ECAD Model
XC5202-3VQ64C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 84 | |
Number of Outputs | 84 | |
Number of Logic Cells | 64 | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 64 CLBS, 2000 GATES | |
Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G64 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 64 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP64,.47SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 10 mm | |
Length | 10 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | TFQFP, TQFP64,.47SQ | |
Pin Count | 64 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC5202-3VQ64C Datasheet Download
XC5202-3VQ64C Overview
The XC5202-3VQ64C chip model is a powerful tool for the development of intelligent networks and systems. This model is designed to provide a wide range of capabilities, including high performance, low power consumption, and an integrated development environment. It is capable of supporting a variety of applications, from simple networked applications to complex intelligent scenarios.
The XC5202-3VQ64C chip model is a multi-core processor with a 64-bit architecture. It has a wide range of features that make it suitable for networked applications, including a large number of general-purpose I/O pins, a wide range of peripheral interfaces, and a variety of memory and storage options. This model also features a high-speed data bus, allowing for rapid communication between different components.
The XC5202-3VQ64C chip model is an ideal choice for the development of intelligent systems. It is capable of supporting a wide range of applications, from simple networked applications to complex intelligent scenarios. This model is also suitable for the development and popularization of future intelligent robots, as it provides the necessary hardware and software capabilities.
The product description and specific design requirements of the XC5202-3VQ64C chip model are available in the product documentation. This includes a detailed description of the various components and features of the model, as well as a list of the necessary tools and software needed to use the model effectively. In addition, actual case studies and precautions are also included in the product documentation.
The XC5202-3VQ64C chip model has the potential to be used in the era of fully intelligent systems. With its powerful features and capabilities, this model can be used to develop a wide range of applications, from simple networked applications to complex intelligent scenarios. In order to use the model effectively, technical talents such as software engineers and hardware engineers are needed.
In conclusion, the XC5202-3VQ64C chip model is a powerful tool for the development of intelligent networks and systems. This model is capable of supporting a variety of applications, from simple networked applications to complex intelligent scenarios. It is also suitable for the development and popularization of future intelligent robots. The product documentation provides a detailed description of the various components and features of the model, as well as a list of the necessary tools and software needed to use the model effectively. With its powerful features and capabilities, this model can be used to develop a wide range of applications, from simple networked applications to complex intelligent scenarios.
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