AMD Xilinx
XC5202-3PG156C
XC5202-3PG156C ECAD Model
XC5202-3PG156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 84 | |
| Number of Outputs | 84 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 2000 GATES | |
| Additional Feature | MAX AVAILABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P156 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 156 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA156,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA156,16X16 | |
| Pin Count | 156 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5202-3PG156C Datasheet Download
XC5202-3PG156C Overview
The chip model XC5202-3PG156C is a highly advanced semiconductor device designed to meet the needs of modern communication systems. It is an integrated circuit that supports a wide range of applications, including high-speed data transmission, digital signal processing, and wireless communication. This chip model has been designed to support a variety of communication systems, from basic 2G/3G cellular networks to advanced 5G and beyond.
The XC5202-3PG156C is designed to be highly reliable and efficient, and its performance is optimized for the needs of modern communication systems. It has been designed to be highly power-efficient and is capable of providing high-speed data transmission, digital signal processing, and wireless communication. The chip model also supports a variety of advanced communication protocols, including 802.11b/g/n and Bluetooth.
The chip model XC5202-3PG156C is also designed to be highly versatile, allowing it to be used in a variety of different applications. It can be used in a variety of network environments, including cellular networks, Wi-Fi networks, and satellite networks. It can also be used in a variety of intelligent scenarios, such as automated vehicles, smart homes, and smart cities. In addition, the chip model is capable of supporting a variety of advanced technologies, such as machine learning and artificial intelligence.
The chip model XC5202-3PG156C is designed to be highly upgradable, allowing it to be used in future applications. It has been designed to be highly compatible with future technologies, such as 5G networks, and can be used in the era of fully intelligent systems. This chip model can also be used in a variety of different networks, including those that use advanced technologies such as machine learning and artificial intelligence.
In conclusion, the chip model XC5202-3PG156C is a highly advanced semiconductor device designed to meet the needs of modern communication systems. It is highly reliable and efficient, and its performance is optimized for the needs of modern communication systems. It is also highly upgradable and can be used in a variety of different networks and intelligent scenarios. Finally, it is capable of supporting a variety of advanced technologies, such as machine learning and artificial intelligence, making it suitable for use in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||