XC4VFX60-12FF1152I
XC4VFX60-12FF1152I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC4VFX60-12FF1152I


XC4VFX60-12FF1152I
F20-XC4VFX60-12FF1152I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, 1 MM PITCH, MS-034-AAR-1, FBGA-1152
35 X 35 MM, 1 MM PITCH, MS-034-AAR-1, FBGA-1152

XC4VFX60-12FF1152I ECAD Model


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XC4VFX60-12FF1152I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of CLBs 6320
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 6320 CLBS
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Package Description 35 X 35 MM, 1 MM PITCH, MS-034-AAR-1, FBGA-1152
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 1152

XC4VFX60-12FF1152I Datasheet Download


XC4VFX60-12FF1152I Overview



The XC4VFX60-12FF1152I chip model is a powerful, high-performance device designed for digital signal processing, embedded processing, and image processing applications. This chip model is equipped with a variety of features and functions that make it an ideal choice for a wide range of applications.


The XC4VFX60-12FF1152I chip model is designed with the HDL (Hardware Description Language) language, which is the preferred language for creating complex designs. This language allows for a high level of abstraction and makes it easier for developers to create complex designs. It also allows for greater flexibility in the design process, as it can be used to create custom designs with specific requirements.


The XC4VFX60-12FF1152I chip model has a number of advantages, such as its high-performance capabilities, its low power consumption, and its ability to handle complex tasks. Additionally, it is capable of handling large amounts of data, making it ideal for applications such as image processing.


The XC4VFX60-12FF1152I chip model is expected to be in high demand in the future, as it is extremely versatile and can be used in a variety of applications. This chip model is well-suited for applications such as medical imaging, industrial automation, automotive systems, and more. It is also suitable for use in embedded systems, as it can handle a variety of tasks with ease.


The product description and design requirements for the XC4VFX60-12FF1152I chip model are detailed in the product manual. It is important to read through the product manual carefully, as it will provide detailed information about the features and capabilities of the chip model. Additionally, it is important to read through the actual case studies and precautions provided in the product manual, as this will provide valuable information about how to properly use the chip model in various applications.


Overall, the XC4VFX60-12FF1152I chip model is a powerful, high-performance device that is suitable for a variety of applications. It is designed with the HDL language, which allows for a high level of abstraction and makes it easier for developers to create complex designs. Additionally, it has a number of advantages, including its high-performance capabilities, its low power consumption, and its ability to handle complex tasks. It is expected to be in high demand in the future, as it is extremely versatile and can be used in a variety of applications. It is important to read through the product manual and actual case studies and precautions provided in the product manual, as this will provide valuable information about how to properly use the chip model in various applications.



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