
AMD Xilinx
XC4VFX60-12FF1152I
XC4VFX60-12FF1152I ECAD Model
XC4VFX60-12FF1152I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of CLBs | 6320 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6320 CLBS | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | 35 X 35 MM, 1 MM PITCH, MS-034-AAR-1, FBGA-1152 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 1152 |
XC4VFX60-12FF1152I Datasheet Download
XC4VFX60-12FF1152I Overview
The XC4VFX60-12FF1152I chip model is a powerful, high-performance device designed for digital signal processing, embedded processing, and image processing applications. This chip model is equipped with a variety of features and functions that make it an ideal choice for a wide range of applications.
The XC4VFX60-12FF1152I chip model is designed with the HDL (Hardware Description Language) language, which is the preferred language for creating complex designs. This language allows for a high level of abstraction and makes it easier for developers to create complex designs. It also allows for greater flexibility in the design process, as it can be used to create custom designs with specific requirements.
The XC4VFX60-12FF1152I chip model has a number of advantages, such as its high-performance capabilities, its low power consumption, and its ability to handle complex tasks. Additionally, it is capable of handling large amounts of data, making it ideal for applications such as image processing.
The XC4VFX60-12FF1152I chip model is expected to be in high demand in the future, as it is extremely versatile and can be used in a variety of applications. This chip model is well-suited for applications such as medical imaging, industrial automation, automotive systems, and more. It is also suitable for use in embedded systems, as it can handle a variety of tasks with ease.
The product description and design requirements for the XC4VFX60-12FF1152I chip model are detailed in the product manual. It is important to read through the product manual carefully, as it will provide detailed information about the features and capabilities of the chip model. Additionally, it is important to read through the actual case studies and precautions provided in the product manual, as this will provide valuable information about how to properly use the chip model in various applications.
Overall, the XC4VFX60-12FF1152I chip model is a powerful, high-performance device that is suitable for a variety of applications. It is designed with the HDL language, which allows for a high level of abstraction and makes it easier for developers to create complex designs. Additionally, it has a number of advantages, including its high-performance capabilities, its low power consumption, and its ability to handle complex tasks. It is expected to be in high demand in the future, as it is extremely versatile and can be used in a variety of applications. It is important to read through the product manual and actual case studies and precautions provided in the product manual, as this will provide valuable information about how to properly use the chip model in various applications.
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QTY | Unit Price | Ext Price |
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