AMD Xilinx
XC4VFX40-12FF1152C
XC4VFX40-12FF1152C ECAD Model
XC4VFX40-12FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 41904 | |
| Number of CLBs | 4656 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4656 CLBS | |
| Clock Frequency-Max | 1.181 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1152 | |
| ECCN Code | 3A991.D |
XC4VFX40-12FF1152C Datasheet Download
XC4VFX40-12FF1152C Overview
The XC4VFX40-12FF1152C chip model is a low-power, high-performance FPGA (Field Programmable Gate Array) developed by Xilinx. It is one of the most advanced FPGAs on the market today and has been widely used in various industries. In the future, the demand for this chip model will continue to increase due to its unique advantages.
The XC4VFX40-12FF1152C chip model has a number of advantages, including low power consumption, high performance, and a wide range of applications. It can be used in a variety of networks, such as 5G, 4G, and Wi-Fi networks, and can be used to provide a wide range of services, such as data processing, storage, and communications. In addition, the chip model is also suitable for a range of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous driving.
In the future, the XC4VFX40-12FF1152C chip model is expected to be widely used in the development and popularization of intelligent robots. The chip model has the advantages of high performance, low power consumption, and a wide range of applications, which make it ideal for the development of intelligent robots. In addition, it can be used to provide a range of services, such as data processing, storage, and communications.
In order to use the XC4VFX40-12FF1152C chip model effectively, certain technical talents are needed. These include knowledge of FPGA design, computer vision, machine learning, artificial intelligence, and robotics. In addition, knowledge of computer programming, electrical engineering, and other related disciplines is also essential.
Overall, the XC4VFX40-12FF1152C chip model has a number of advantages and is expected to be widely used in the future. It can be used in a variety of networks and intelligent scenarios and is ideal for the development and popularization of intelligent robots. In order to use the chip model effectively, certain technical talents are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||