
AMD Xilinx
XC4VFX20-12FFG672C
XC4VFX20-12FFG672C ECAD Model
XC4VFX20-12FFG672C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 320 | |
Number of Outputs | 320 | |
Number of Logic Cells | 19224 | |
Number of CLBs | 2136 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2136 CLBS | |
Clock Frequency-Max | 1.181 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-672 | |
Pin Count | 672 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC4VFX20-12FFG672C Datasheet Download
XC4VFX20-12FFG672C Overview
The chip model XC4VFX20-12FFG672C is a powerful and reliable semiconductor chip that has been developed by Xilinx for a wide range of applications. This chip is a low-power, high-performance Field Programmable Gate Array (FPGA) that provides a great deal of flexibility for users. It is specifically designed for high-speed, high-performance applications such as machine learning, video and image processing, and artificial intelligence.
The XC4VFX20-12FFG672C chip offers several advantages over other FPGA chips. It is capable of operating at higher clock speeds and offers more efficient power consumption. It also has a large number of configurable logic blocks, which allows users to create custom designs. Additionally, it supports a wide range of I/O protocols, allowing it to be used in a variety of different applications.
In terms of future demand trends, the XC4VFX20-12FFG672C chip is expected to be in high demand in the coming years. This is due to its high performance, low power consumption, and flexibility. As more applications require high-speed, high-performance processing, the XC4VFX20-12FFG672C chip is expected to be a popular choice for users. Additionally, as new technologies are developed, the chip is expected to be able to support them.
In terms of product description and design requirements, the XC4VFX20-12FFG672C chip is a low-power, high-performance FPGA with a wide range of features. It has a total of 12,672 logic cells, which can be configured for a variety of applications. It also has up to 8,192 bits of RAM, which can be used for storing data. Additionally, it has a wide range of I/O protocols, including Ethernet, USB, and PCI Express.
In terms of actual case studies and precautions, the XC4VFX20-12FFG672C chip has been used in a variety of applications, including machine learning, video and image processing, and artificial intelligence. In each of these cases, the chip has been able to provide the necessary performance and power efficiency. Additionally, it has been found to be reliable in a variety of environments. However, when using the chip, users should be aware of the potential risks associated with using FPGAs, such as electrostatic discharge and power supply issues.
Overall, the XC4VFX20-12FFG672C chip is a powerful and reliable semiconductor chip that offers a great deal of flexibility for users. It is capable of operating at higher clock speeds and offers more efficient power consumption. Additionally, it supports a wide range of I/O protocols, allowing it to be used in a variety of different applications. As new technologies are developed, the chip is expected to be able to support them. However, when using the chip, users should be aware of the potential risks associated with using FPGAs, such as electrostatic discharge and power supply issues.
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