XC4VFX20-12FFG672C
XC4VFX20-12FFG672C
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rohs

AMD Xilinx

XC4VFX20-12FFG672C


XC4VFX20-12FFG672C
F20-XC4VFX20-12FFG672C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-672
LEAD FREE, FBGA-672

XC4VFX20-12FFG672C ECAD Model


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XC4VFX20-12FFG672C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 320
Number of Outputs 320
Number of Logic Cells 19224
Number of CLBs 2136
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2136 CLBS
Clock Frequency-Max 1.181 GHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-672
Pin Count 672
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC4VFX20-12FFG672C Datasheet Download


XC4VFX20-12FFG672C Overview



The chip model XC4VFX20-12FFG672C is a powerful and reliable semiconductor chip that has been developed by Xilinx for a wide range of applications. This chip is a low-power, high-performance Field Programmable Gate Array (FPGA) that provides a great deal of flexibility for users. It is specifically designed for high-speed, high-performance applications such as machine learning, video and image processing, and artificial intelligence.


The XC4VFX20-12FFG672C chip offers several advantages over other FPGA chips. It is capable of operating at higher clock speeds and offers more efficient power consumption. It also has a large number of configurable logic blocks, which allows users to create custom designs. Additionally, it supports a wide range of I/O protocols, allowing it to be used in a variety of different applications.


In terms of future demand trends, the XC4VFX20-12FFG672C chip is expected to be in high demand in the coming years. This is due to its high performance, low power consumption, and flexibility. As more applications require high-speed, high-performance processing, the XC4VFX20-12FFG672C chip is expected to be a popular choice for users. Additionally, as new technologies are developed, the chip is expected to be able to support them.


In terms of product description and design requirements, the XC4VFX20-12FFG672C chip is a low-power, high-performance FPGA with a wide range of features. It has a total of 12,672 logic cells, which can be configured for a variety of applications. It also has up to 8,192 bits of RAM, which can be used for storing data. Additionally, it has a wide range of I/O protocols, including Ethernet, USB, and PCI Express.


In terms of actual case studies and precautions, the XC4VFX20-12FFG672C chip has been used in a variety of applications, including machine learning, video and image processing, and artificial intelligence. In each of these cases, the chip has been able to provide the necessary performance and power efficiency. Additionally, it has been found to be reliable in a variety of environments. However, when using the chip, users should be aware of the potential risks associated with using FPGAs, such as electrostatic discharge and power supply issues.


Overall, the XC4VFX20-12FFG672C chip is a powerful and reliable semiconductor chip that offers a great deal of flexibility for users. It is capable of operating at higher clock speeds and offers more efficient power consumption. Additionally, it supports a wide range of I/O protocols, allowing it to be used in a variety of different applications. As new technologies are developed, the chip is expected to be able to support them. However, when using the chip, users should be aware of the potential risks associated with using FPGAs, such as electrostatic discharge and power supply issues.



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