AMD Xilinx
XC4VFX12-12FF668C
XC4VFX12-12FF668C ECAD Model
XC4VFX12-12FF668C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 320 | |
| Number of Outputs | 320 | |
| Number of Logic Cells | 12312 | |
| Number of CLBs | 1368 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1368 CLBS | |
| Clock Frequency-Max | 1.205 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-668 | |
| Pin Count | 668 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC4VFX12-12FF668C Datasheet Download
XC4VFX12-12FF668C Overview
The XC4VFX12-12FF668C chip model is a powerful, high-performance digital signal processor designed for a range of applications, including embedded processing, image processing, and more. It is equipped with advanced features such as a 12-stage pipeline, dual-issue VLIW architecture, and a variety of peripherals, making it an ideal choice for digital signal processing.
The XC4VFX12-12FF668C chip model offers a number of advantages, including a high processing speed, low power consumption, and a wide range of peripherals. It is also designed for use with the HDL language, which makes it easier to program and debug. In addition, the chip model is highly configurable, allowing users to tailor it to their specific needs.
The demand for the XC4VFX12-12FF668C chip model is expected to grow significantly in the future, as more and more applications require high-performance digital signal processing. As such, the chip model is expected to become increasingly popular in a variety of industries, including automotive, industrial automation, and consumer electronics.
When designing with the XC4VFX12-12FF668C chip model, there are a few important considerations to keep in mind. For example, it is important to understand the device’s power consumption, as well as the maximum clock frequency and the number of peripherals available. Additionally, it is important to understand the device’s architecture and its capabilities in order to ensure that the design meets the desired specifications.
In order to ensure successful implementation of the XC4VFX12-12FF668C chip model, it is important to review actual case studies and consider any potential pitfalls. Additionally, it is important to ensure that the design is optimized for the specific application and that the HDL code is properly written and debugged. By taking these steps, designers can ensure that the XC4VFX12-12FF668C chip model is used to its full potential.
You May Also Be Interested In
1,187 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $349.6824 | $349.6824 |
| 10+ | $345.9224 | $3,459.2239 |
| 100+ | $327.1223 | $32,712.2262 |
| 1000+ | $308.3221 | $154,161.0660 |
| 10000+ | $282.0020 | $282,001.9500 |
| The price is for reference only, please refer to the actual quotation! | ||