AMD Xilinx
XC4VFX12-11SF363C
XC4VFX12-11SF363C ECAD Model
XC4VFX12-11SF363C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 12312 | |
| Number of CLBs | 1368 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1368 CLBS | |
| Clock Frequency-Max | 1.181 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B363 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 363 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA363,20X20,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.99 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-363 | |
| Pin Count | 363 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC4VFX12-11SF363C Datasheet Download
XC4VFX12-11SF363C Overview
The XC4VFX12-11SF363C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) and provides users with a wide range of capabilities. This chip model is suitable for a variety of applications, from consumer electronics to industrial automation.
The XC4VFX12-11SF363C chip model has several advantages over its competitors. It is highly scalable, meaning it can be upgraded to meet the demands of a variety of applications. It has a low power consumption, making it an ideal choice for applications that require a low power budget. It also has a high-speed clock rate, which makes it suitable for high-performance tasks.
The XC4VFX12-11SF363C chip model is expected to have a strong demand in the near future. With the increasing use of technology in our everyday lives, the need for high-performance digital signal processing, embedded processing, and image processing is growing. The XC4VFX12-11SF363C chip model is well-suited to meet these needs.
In terms of the application environment, the XC4VFX12-11SF363C chip model is compatible with a variety of technologies. It is designed to be used with the HDL language and can be used with other technologies such as FPGAs, microcontrollers, and ASICs. It is also compatible with a variety of operating systems and programming languages.
The XC4VFX12-11SF363C chip model is an excellent choice for applications requiring high-performance digital signal processing, embedded processing, and image processing. Its scalability, low power consumption, and high-speed clock rate make it ideal for a variety of applications. With the increasing demand for these types of applications, the XC4VFX12-11SF363C chip model is expected to be in high demand in the near future. Its compatibility with a variety of technologies and operating systems makes it a versatile choice for a variety of applications.
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1,964 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $119.0400 | $119.0400 |
| 10+ | $117.7600 | $1,177.6000 |
| 100+ | $111.3600 | $11,136.0000 |
| 1000+ | $104.9600 | $52,480.0000 |
| 10000+ | $96.0000 | $96,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||