
AMD Xilinx
XC4VFX100-12FFG1152C
XC4VFX100-12FFG1152C ECAD Model
XC4VFX100-12FFG1152C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 576 | |
Number of Outputs | 576 | |
Number of Logic Cells | 94896 | |
Number of CLBs | 10544 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 10544 CLBS | |
Clock Frequency-Max | 1.181 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-1152 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC4VFX100-12FFG1152C Datasheet Download
XC4VFX100-12FFG1152C Overview
The chip model XC4VFX100-12FFG1152C is a high-performance FPGA chip that is suitable for digital signal processing, embedded processing, image processing and other applications. It requires the use of HDL language, making it an ideal choice for those seeking to build high-performance systems.
The industry trends of the chip model XC4VFX100-12FFG1152C and the future development of related industries are largely dependent on the specific technologies that are needed. New technologies may be required to support the application environment, such as artificial intelligence, machine learning, and data analytics.
The chip model XC4VFX100-12FFG1152C can be applied to the development and popularization of future intelligent robots, but the technical talents needed to use the model effectively depend on the specific application. For example, if the application requires the use of artificial intelligence, then engineers with knowledge of AI algorithms, machine learning and data analytics may be needed. On the other hand, if the application requires image processing, then engineers with knowledge of image processing algorithms may be needed.
In conclusion, the chip model XC4VFX100-12FFG1152C is a high-performance FPGA chip that is suitable for digital signal processing, embedded processing, image processing and other applications. It can be used in the development and popularization of future intelligent robots, but the technical talents needed to use the model effectively depend on the specific application.
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