AMD Xilinx
XC4085XL-2PG559I
XC4085XL-2PG559I ECAD Model
XC4085XL-2PG559I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 3136 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | MAX USABLE 85000 LOGIC GATES | |
| Clock Frequency-Max | 179 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-CPGA-P559 | |
| Qualification Status | Not Qualified | |
| Number of Terminals | 559 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | HSPGA559,43X43 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 57.404 mm | |
| Length | 57.404 mm | |
| Seated Height-Max | 5.969 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, HSPGA559,43X43 | |
| Pin Count | 559 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4085XL-2PG559I Datasheet Download
XC4085XL-2PG559I Overview
The XC4085XL-2PG559I chip model is a powerful and efficient processing chip that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. It is designed to be used in conjunction with the Hardware Description Language (HDL) to enable users to customize and optimize their projects.
The original design intention of the XC4085XL-2PG559I chip model was to provide a powerful and efficient processing solution for a variety of applications. It is capable of supporting high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. The chip model also has the capability to be upgraded in the future, allowing users to easily adapt their projects to changing needs.
The product description and design requirements of the XC4085XL-2PG559I chip model are as follows: it is designed to be used with the HDL language and has the capability to be upgraded in the future. It is capable of supporting high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. The chip model also has the capability to be upgraded in the future, allowing users to easily adapt their projects to changing needs.
To better understand the capabilities and design of the XC4085XL-2PG559I chip model, it is important to look at actual case studies and usage scenarios. For example, the chip model has been used in a variety of projects, such as image processing, embedded system design, and advanced communication systems. By looking at these case studies, users can gain a better understanding of how the chip model can be applied in different applications.
Finally, when using the XC4085XL-2PG559I chip model, it is important to keep in mind a few precautions. First, users should always ensure that the chip model is compatible with their project requirements. Second, users should be aware of the chip model’s upgrade capabilities and ensure that their project takes full advantage of them. Finally, users should ensure that they are familiar with the HDL language and understand how to use it to customize and optimize their projects.
Overall, the XC4085XL-2PG559I chip model is a powerful and efficient processing chip that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. By understanding the product description and design requirements of the chip model, as well as looking at actual case studies and usage scenarios, users can gain a better understanding of how the chip model can be applied in different applications. With the right precautions and understanding of the chip model, users can take full advantage of its capabilities and upgrade capabilities to customize and optimize their projects.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||