AMD Xilinx
XC4062XL-3PG475C
XC4062XL-3PG475C ECAD Model
XC4062XL-3PG475C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | MAX USABLE 62000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-CPGA-P475 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 475 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | SPGA475,41X41 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 54.864 mm | |
| Length | 54.864 mm | |
| Seated Height-Max | 5.969 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, SPGA475,41X41 | |
| Pin Count | 475 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4062XL-3PG475C Datasheet Download
XC4062XL-3PG475C Overview
The XC4062XL-3PG475C chip model is a high-performance digital signal processor (DSP) that is suitable for a range of applications such as embedded processing, image processing, and more. It requires the use of HDL language for programming, making it a powerful tool for a wide range of industries.
The chip model is already being used in many industries, from automotive to consumer electronics and beyond. It is also being used in the medical field, where it is being used to process data from medical imaging and other medical applications.
As the technology behind the chip model continues to develop, new applications and scenarios are becoming possible. For example, it can be used for networks, providing high-speed data processing for networks of all sizes. It can also be used in intelligent systems, providing the power needed to process large amounts of data in real time.
The chip model is also being used in the era of fully intelligent systems. It can be used to process data from sensors and other sources in order to make decisions and take actions. It can also be used to provide the power needed to run machine learning and artificial intelligence algorithms.
The chip model is also being used in the realm of robotics, providing the power needed to process data from sensors and other sources in order to make decisions and take actions. It can also be used to power robotic arms and other robotic systems.
Finally, the chip model is also being used in the world of virtual reality. It can be used to provide the power needed to process large amounts of data in real-time, allowing for more immersive virtual reality experiences.
Overall, the XC4062XL-3PG475C chip model is a powerful tool for a wide range of industries. As technology continues to develop, new applications and scenarios are becoming possible. It is an invaluable tool in the world of digital signal processing, embedded processing, image processing, networks, intelligent systems, robotics, and virtual reality.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||