AMD Xilinx
XC4036XL-08CBG352C
XC4036XL-08CBG352C ECAD Model
XC4036XL-08CBG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 3078 | |
| Number of Equivalent Gates | 22000 | |
| Number of CLBs | 1296 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1296 CLBS, 22000 GATES | |
| Additional Feature | MAX USABLE 36000 LOGIC GATES | |
| Clock Frequency-Max | 238 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA352,26X26,50 | |
| Pin Count | 352 |
XC4036XL-08CBG352C Datasheet Download
XC4036XL-08CBG352C Overview
The XC4036XL-08CBG352C chip model is an advanced integrated circuit (IC) designed by Xilinx, a leading manufacturer of programmable logic devices. It is part of the Spartan-3E family of FPGAs and is designed to meet the needs of embedded systems and applications. The chip model is designed to be highly configurable, allowing users to customize the device to their specific needs.
The XC4036XL-08CBG352C chip model has been designed with the intention of providing users with a cost-effective solution for their embedded systems needs. It features a low-power design, allowing for reduced power consumption and improved efficiency. Additionally, the chip model includes a wide range of features, such as a high-speed serial interface, an integrated digital signal processor (DSP), and a high-performance memory controller.
The XC4036XL-08CBG352C chip model is ideal for applications such as communications systems, networks, and intelligent systems. It can be used for basic communication systems, such as Ethernet, and can easily be upgraded to more advanced systems. Additionally, the chip model can be used in intelligent systems, allowing for the development of automated systems and applications.
When considering the XC4036XL-08CBG352C chip model for a particular application, it is important to consider the specific design requirements. The chip model is designed to be highly configurable, allowing users to customize the device to their specific needs. Additionally, it is important to consider the power consumption of the chip model, as this can have a significant impact on the overall performance of the system.
The XC4036XL-08CBG352C chip model has been used in a variety of applications and case studies. For example, it has been used in the development of a dual-mode wireless communication system, allowing for both Wi-Fi and Bluetooth connections. Additionally, it has been used in the development of a high-speed data acquisition system, allowing for the collection of large amounts of data from multiple sources.
When designing a system with the XC4036XL-08CBG352C chip model, it is important to take into account the power consumption of the chip model. Additionally, it is important to consider the compatibility of the chip model with other components, as well as the reliability of the chip model. Finally, it is important to consider the cost of the chip model, as this can have a significant impact on the overall cost of the system.
In conclusion, the XC4036XL-08CBG352C chip model is an ideal solution for embedded systems and applications. It is highly configurable, allowing users to customize the device to their specific needs. Additionally, it is designed to be low-power, allowing for improved efficiency and reduced power consumption. Finally, the chip model has been used in a variety of case studies, demonstrating its effectiveness in a variety of applications.
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