AMD Xilinx
XC3S500E-5FG320C
XC3S500E-5FG320C ECAD Model
XC3S500E-5FG320C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 232 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 10476 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 1164 | |
| Combinatorial Delay of a CLB-Max | 660 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1164 CLBS, 500000 GATES | |
| Clock Frequency-Max | 657 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B320 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 320 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA320,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 19 X 19 MM, 2 MM HEIGHT, 1 MM PITCH, FBGA-320 | |
| Pin Count | 320 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC3S500E-5FG320C Datasheet Download
XC3S500E-5FG320C Overview
XC3S500E-5FG320C is an advanced FPGA chip model from Xilinx, a leading provider of programmable logic solutions. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. This chip model is suitable for applications that require a high level of flexibility, reliability, and scalability.
The XC3S500E-5FG320C chip model is equipped with a wide range of features, including a large number of configurable I/Os and a high-performance Virtex-5 FPGA fabric. This chip model is also equipped with an advanced power management system, which helps to reduce power consumption and heat dissipation. Additionally, the chip model supports the use of HDL language, which is used to program and configure the chip.
The XC3S500E-5FG320C chip model offers a number of advantages that make it an ideal choice for many applications. It has a high level of integration, which helps to reduce system costs and complexity. It also has a high level of scalability, which allows users to easily increase the number of I/Os and processing power as needed. Additionally, the chip model is designed to be reliable and secure, making it suitable for use in mission-critical applications.
The XC3S500E-5FG320C chip model is expected to be in high demand in the future, as it is suitable for a variety of applications. It is particularly well-suited for applications that require high levels of performance, flexibility, and scalability. Examples of such applications include digital signal processing, embedded processing, and image processing.
In order to make full use of the XC3S500E-5FG320C chip model, it is important to understand its product description and design requirements. The chip model has a total of 500K system gates, with up to 32 I/O banks. It also has up to 4.5Mbits of embedded memory, and supports a wide range of I/O standards. Additionally, the chip model supports a variety of programming languages, including VHDL and Verilog.
When designing with the XC3S500E-5FG320C chip model, it is important to take certain precautions. For example, it is important to ensure that the power supply is stable and that the system is properly cooled. Additionally, it is important to ensure that the design is properly optimized to make full use of the chip's features.
The XC3S500E-5FG320C chip model is a powerful and versatile FPGA solution that is suitable for a variety of applications. With its high level of integration, scalability, and reliability, it is expected to be in high demand in the future. By understanding its product description and design requirements, and taking the necessary precautions, users can make full use of this chip model and its many advantages.
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