AMD Xilinx
XC3S500E-5CP132C
XC3S500E-5CP132C ECAD Model
XC3S500E-5CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 10476 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 1164 | |
| Combinatorial Delay of a CLB-Max | 660 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1164 CLBS, 500000 GATES | |
| Clock Frequency-Max | 657 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 8 MM, 1.10 MM HEIGHT, 0.50 MM PITCH, CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S500E-5CP132C Datasheet Download
XC3S500E-5CP132C Overview
The XC3S500E-5CP132C chip model is a high-performance digital signal processing chip designed for embedded processing, image processing, and other applications. It is a powerful and versatile chip that can be used in a variety of applications and scenarios. The chip is programmed using HDL language, making it an ideal choice for developers and engineers looking to create complex systems.
The XC3S500E-5CP132C chip model is capable of being used in networks and various intelligent scenarios. It can be used to develop and popularize future intelligent robots and other intelligent systems. Its powerful processing capabilities allow it to be used in the era of fully intelligent systems. This chip model can be used to create complex systems that can be used in a variety of applications, from medical to industrial.
The XC3S500E-5CP132C chip model requires a certain level of technical knowledge and skill to use effectively. It is important for developers and engineers to have a good understanding of HDL language and be able to write programs in order to utilize the chip model to its fullest potential. Additionally, it is important for developers to have a good understanding of the applications and scenarios in which the chip model can be used in order to create the most effective solutions.
Overall, the XC3S500E-5CP132C chip model is a powerful and versatile chip that can be used in a variety of applications and scenarios. It is capable of being used in networks and various intelligent scenarios, and can be used to develop and popularize future intelligent robots and other intelligent systems. The chip model requires a certain level of technical knowledge and skill to use effectively, making it an ideal choice for developers and engineers looking to create complex systems.
2,183 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $32.3938 | $32.3938 |
| 10+ | $32.0454 | $320.4544 |
| 100+ | $30.3038 | $3,030.3840 |
| 1000+ | $28.5622 | $14,281.1200 |
| 10000+ | $26.1240 | $26,124.0000 |
| The price is for reference only, please refer to the actual quotation! | ||