AMD Xilinx
XC3S500E-4FTG256CS1
XC3S500E-4FTG256CS1 ECAD Model
XC3S500E-4FTG256CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 190 | |
| Number of Outputs | 149 | |
| Number of Logic Cells | 10476 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 1164 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1164 CLBS, 500000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3S500E-4FTG256CS1 Datasheet Download
XC3S500E-4FTG256CS1 Overview
The XC3S500E-4FTG256CS1 chip model has been developed by the Xilinx Corporation, and it is a highly advanced Field Programmable Gate Array (FPGA) that is designed to provide high-performance computing capabilities. This chip model offers a lot of advantages in terms of power efficiency, cost-effectiveness, and scalability. It is also capable of providing a wide range of flexible and reliable computing solutions for various industries.
The expected demand for the XC3S500E-4FTG256CS1 chip model in the future is likely to be very high. This is mainly due to the fact that the chip model is designed to be energy-efficient, cost-effective, and highly scalable. It is also capable of providing a wide range of computing solutions for various industries, such as medical, automotive, aerospace, and industrial. In addition, the chip model is also expected to be used in the development and popularization of future intelligent robots.
The XC3S500E-4FTG256CS1 chip model can be applied to various intelligent scenarios in the future, such as networks and distributed computing. This chip model is also capable of providing a wide range of computing solutions for various industries, such as medical, automotive, aerospace, and industrial. In addition, the chip model is also expected to be used in the development and popularization of future intelligent robots.
In order to use the XC3S500E-4FTG256CS1 chip model effectively, there are certain technical talents that are required. These include knowledge in digital design, embedded systems, computer architecture, and software engineering. In addition, the chip model also requires knowledge in the application of artificial intelligence, machine learning, and deep learning. These technical talents are essential in order to effectively use the chip model in the development and popularization of future intelligent robots.
Overall, the XC3S500E-4FTG256CS1 chip model is a highly advanced and powerful FPGA that is designed to provide high-performance computing capabilities. It is expected to have a high demand in the future due to its energy-efficiency, cost-effectiveness, and scalability. The chip model can be applied to various intelligent scenarios, such as networks and distributed computing, and it can also be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are required, such as knowledge in digital design, embedded systems, computer architecture, and software engineering.
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1,965 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $62.1179 | $62.1179 |
| 10+ | $61.4499 | $614.4993 |
| 100+ | $58.1103 | $5,811.0258 |
| 1000+ | $54.7706 | $27,385.2940 |
| 10000+ | $50.0951 | $50,095.0500 |
| The price is for reference only, please refer to the actual quotation! | ||