AMD Xilinx
XC3S50-5PQG208C
XC3S50-5PQG208C ECAD Model
XC3S50-5PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 124 | |
| Number of Outputs | 124 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 192 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 192 CLBS, 50000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 30.60 X 30.60 MM, LEAD FREE, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S50-5PQG208C Datasheet Download
XC3S50-5PQG208C Overview
The Xilinx XC3S50-5PQG208C is a field-programmable gate array (FPGA) chip designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. This chip is designed to provide a robust, reliable, and high-performance platform for a variety of applications, including communications, data processing, embedded systems, and digital signal processing.
The XC3S50-5PQG208C chip is designed to provide a high level of flexibility and scalability. The chip is equipped with a large number of logic cells, memory blocks, and I/O pins. This allows for the chip to be easily customized for a variety of applications. Additionally, the chip is designed to be upgradeable, allowing for future upgrades and enhancements to be made.
The XC3S50-5PQG208C chip is designed to be used in a variety of communication systems, from basic wireless networks to more advanced fiber-optic networks. This chip is also designed to be used in intelligent systems, allowing for data processing, machine learning, and artificial intelligence applications. Additionally, the chip is designed to be used in the era of fully intelligent systems, allowing for the development of autonomous systems and robots.
The XC3S50-5PQG208C chip is designed to meet the specific needs of a variety of applications. The chip is equipped with a variety of features, including a high-speed transceiver, a large number of logic cells, and a wide range of I/O pins. Additionally, the chip is equipped with a number of memory blocks, allowing for the storage of data and instructions.
When considering the use of the XC3S50-5PQG208C chip, it is important to consider the specific requirements of the application. Additionally, it is important to consider the potential for future upgrades and enhancements. Additionally, it is important to consider the potential for the chip to be used in the era of fully intelligent systems. Additionally, it is important to consider the potential for the chip to be used in a variety of communication systems.
Case studies can provide a good insight into the potential of the XC3S50-5PQG208C chip. For example, the chip has been used in a variety of projects, including a wireless communication system, a machine learning application, and a robotic arm. Additionally, the chip has been used in a variety of other applications, such as data processing, embedded systems, and digital signal processing.
When using the XC3S50-5PQG208C chip, it is important to consider the potential for failure. The chip is designed to provide a high level of reliability and performance, but it is important to consider the potential for failure. Additionally, it is important to consider the potential for the chip to be damaged by electrical or environmental conditions. Additionally, it is important to consider the potential for the chip to be damaged by physical or chemical processes.
In conclusion, the XC3S50-5PQG208C is a powerful and versatile chip designed to provide a high level of performance and flexibility. The chip is designed to be used in a variety of applications, including communications, data processing, embedded systems, and digital signal processing. Additionally, the chip is designed to be upgradeable, allowing for future upgrades and enhancements to be made. Additionally, the chip is designed to be used in the era of fully intelligent systems, allowing for the development of autonomous systems and robots. When considering the use of the XC3S50-5PQG208C chip, it is important to consider the specific requirements of the application, the potential for future upgrades and enhancements, the potential for the chip to be used in the era of fully intelligent systems, and the potential for failure.
3,717 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.0990 | $23.0990 |
| 10+ | $22.8506 | $228.5059 |
| 100+ | $21.6087 | $2,160.8712 |
| 1000+ | $20.3668 | $10,183.4160 |
| 10000+ | $18.6282 | $18,628.2000 |
| The price is for reference only, please refer to the actual quotation! | ||