AMD Xilinx
XC3S400-5FT256I
XC3S400-5FT256I ECAD Model
XC3S400-5FT256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 173 | |
| Number of Outputs | 173 | |
| Number of Logic Cells | 8064 | |
| Number of Equivalent Gates | 400000 | |
| Number of CLBs | 896 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 896 CLBS, 400000 GATES | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S400-5FT256I Datasheet Download
XC3S400-5FT256I Overview
The XC3S400-5FT256I chip model is a highly advanced and powerful model from the Xilinx family of FPGA chips. It is a field-programmable gate array (FPGA) that can be used for a wide range of applications, from high-performance computing to embedded systems. It is a versatile chip with a wide range of features and capabilities, allowing it to be used in a variety of different applications.
The XC3S400-5FT256I chip model is designed to be highly efficient, reliable, and cost-effective. It is capable of supporting a variety of different technologies, including high-speed serial communications, digital signal processing, and embedded memory. It also supports high-speed, low-power, and high-performance computing. Additionally, it can be used to build networks, as well as intelligent systems.
The XC3S400-5FT256I chip model is designed to be highly flexible and scalable. It can be easily upgraded to support new technologies and applications. The chip model is also designed to be suitable for use in advanced communication systems, such as 5G networks, as well as intelligent systems. It is also capable of being used in the era of fully intelligent systems, such as artificial intelligence and machine learning.
The XC3S400-5FT256I chip model is designed to be highly reliable and cost-effective. It is capable of providing high performance while consuming low power. Additionally, it is designed to be highly secure and reliable, making it suitable for use in mission-critical applications.
In conclusion, the XC3S400-5FT256I chip model is a powerful and versatile FPGA chip that is capable of supporting a wide range of technologies and applications. It is designed to be highly efficient, reliable, and cost-effective, and can be easily upgraded to support new technologies and applications. It is also suitable for use in advanced communication systems and intelligent systems, making it an ideal solution for a variety of different applications.
5,247 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $58.7966 | $58.7966 |
| 10+ | $58.1643 | $581.6433 |
| 100+ | $55.0032 | $5,500.3227 |
| 1000+ | $51.8421 | $25,921.0610 |
| 10000+ | $47.4166 | $47,416.5750 |
| The price is for reference only, please refer to the actual quotation! | ||