AMD Xilinx
XC3S2000-5FG456C
XC3S2000-5FG456C ECAD Model
XC3S2000-5FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 333 | |
| Number of Outputs | 333 | |
| Number of Logic Cells | 46080 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 5120 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5120 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC3S2000-5FG456C Datasheet Download
XC3S2000-5FG456C Overview
The XC3S2000-5FG456C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, making it an ideal choice for a wide range of applications.
As the chip model is increasingly adopted by industry, it is important to consider the trends of the chip model and the future development of related industries. This includes understanding what specific technologies are needed in the application environment, as well as the original design intention of the chip model and the possibility of future upgrades.
The XC3S2000-5FG456C chip model is based on a powerful FPGA architecture, offering a high degree of flexibility and scalability. This makes it an ideal choice for a wide range of applications, including advanced communication systems. It is designed to be highly configurable, allowing users to easily upgrade and expand the chip model as their needs change.
The XC3S2000-5FG456C chip model is also designed with the latest technologies in mind, allowing it to be used in a wide range of applications. This includes support for advanced communication systems, such as 5G networks, as well as the ability to handle high-performance digital signal processing, embedded processing and image processing.
The XC3S2000-5FG456C chip model is an excellent choice for a wide range of applications, offering a high degree of flexibility and scalability. It is designed to be used with the HDL language, making it an ideal choice for a wide range of applications. With its powerful FPGA architecture and support for the latest technologies, it is an ideal choice for advanced communication systems and high-performance digital signal processing, embedded processing and image processing.
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1,573 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $73.0982 | $73.0982 |
| 10+ | $72.3122 | $723.1218 |
| 100+ | $68.3822 | $6,838.2174 |
| 1000+ | $64.4522 | $32,226.0820 |
| 10000+ | $58.9502 | $58,950.1500 |
| The price is for reference only, please refer to the actual quotation! | ||