AMD Xilinx
XC3S2000-4FG900C
XC3S2000-4FG900C ECAD Model
XC3S2000-4FG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 565 | |
| Number of Outputs | 565 | |
| Number of Logic Cells | 46080 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 5120 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5120 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 630 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, FBGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC3S2000-4FG900C Datasheet Download
XC3S2000-4FG900C Overview
The Xilinx XC3S2000-4FG900C chip is a field-programmable gate array (FPGA) designed to provide high-speed, low-power, and reliable performance. It is a member of the Spartan-3E family and is designed to meet the needs of a wide range of applications. It is an ideal choice for applications that require a large number of logic cells and high-speed communication.
The original design intention of the XC3S2000-4FG900C was to provide a low-cost, low-power, and reliable solution for applications that require a large number of logic cells and high-speed communication. It was designed to be a cost-effective solution for embedded systems, industrial automation, and communications systems. The chip features a large number of programmable logic cells and a high-speed communication interface, making it suitable for a wide range of applications.
The XC3S2000-4FG900C can be used in a variety of applications, ranging from simple logic designs to complex digital signal processing (DSP) applications. It is also suitable for use in advanced communication systems, such as high-speed networks, wireless networks, and optical networks. The chip is also capable of being upgraded in the future, allowing designers to take advantage of the latest technology.
The product description of the XC3S2000-4FG900C includes a number of features that make it an ideal choice for a wide range of applications. It offers a large number of programmable logic cells, a high-speed communication interface, and low power consumption. It also includes a variety of features that make it suitable for a wide range of applications, including embedded systems, industrial automation, and communications systems.
In addition to the features mentioned above, the XC3S2000-4FG900C also includes a number of design considerations that should be taken into account when designing a system. These include the need for a reliable power supply, the need for adequate cooling, and the need for a robust design. It is also important to consider the possibility of future upgrades, as well as any potential security risks.
The XC3S2000-4FG900C is an ideal choice for a wide range of applications, including embedded systems, industrial automation, and communications systems. It is also suitable for use in advanced communication systems, such as high-speed networks, wireless networks, and optical networks. With its large number of programmable logic cells, high-speed communication interface, and low power consumption, the XC3S2000-4FG900C is an excellent choice for applications that require a large number of logic cells and high-speed communication. Furthermore, it is possible to upgrade the chip in the future, allowing designers to take advantage of the latest technology. By taking into account the design considerations mentioned above, designers can ensure that their systems are reliable, secure, and efficient.
2,724 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $98.9526 | $98.9526 |
| 10+ | $97.8886 | $978.8855 |
| 100+ | $92.5685 | $9,256.8522 |
| 1000+ | $87.2485 | $43,624.2460 |
| 10000+ | $79.8005 | $79,800.4500 |
| The price is for reference only, please refer to the actual quotation! | ||