XC3S1600E-4FGG400C

The XC3S1600E-4FGG400C is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is designed for high-performance applications such as embedded systems, communications, and industrial control. The chip is based on the Xilinx Spartan-3E architecture and is manufactured using a 0.4-micron process.

The XC3S1600E-4FGG400C is a high-density device, with a total of 1600 logic cells, and up to 4,096 Kbits of embedded memory. It has a total of 4,096 logic slices, each containing four 6-input Look-Up Tables (LUTs). It also includes two dedicated 18x18 multipliers, and a total of 8,192 flip-flops. The chip has an I/O count of 400, with up to 200 user I/O pins, and up to 200 differential I/O pins. It has a total of 32Kbits of distributed RAM, and up to 32Kbits of distributed ROM.

The XC3S1600E-4FGG400C has a maximum clock frequency of 200 MHz, and a maximum operating temperature of 85 degrees Celsius. It is designed to operate from a single 1.2V power supply, but it can also be operated from a 3.3V supply. The chip has an internal clock generator, and it is compatible with the IEEE 1149.1 JTAG boundary-scan protocol.

The XC3S1600E-4FGG400C is suitable for a wide range of applications, including embedded systems, communications, industrial control, and consumer electronics. It can be used for high-performance signal processing, video processing, and data acquisition. It is also suitable for high-speed networking applications, such as routers and switches. The chip is designed for low power consumption and is RoHS compliant.