AMD Xilinx
XC3S1500-5FG676I
XC3S1500-5FG676I ECAD Model
XC3S1500-5FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 487 | |
| Number of Outputs | 487 | |
| Number of Logic Cells | 29952 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 3328 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3328 CLBS, 1500000 GATES | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | 27 X 27 MM, 2.60 MM HEIGHT, 1 MM PITCH, FBGA-676 | |
| Part Package Code | BGA | |
| Pin Count | 676 |
XC3S1500-5FG676I Datasheet Download
XC3S1500-5FG676I Overview
The XC3S1500-5FG676I chip model is a feature-rich, high-performance device that is designed to meet the needs of a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The XC3S1500-5FG676I chip model has numerous advantages over its competitors. It is a low-cost yet powerful device that is capable of delivering high-speed performance. It is also highly reliable and is designed to be able to withstand harsh environmental conditions. Additionally, the device is easy to program and configure, making it a great choice for those who need a device that is both powerful and user-friendly.
The XC3S1500-5FG676I chip model is expected to have a high demand in the future due to its versatile capabilities and its ability to meet the needs of a wide range of applications. The device is well-suited for use in a variety of industries, such as automotive, consumer electronics, and industrial automation. Additionally, the device is expected to be used in emerging technologies such as artificial intelligence and machine learning.
The application environment for the XC3S1500-5FG676I chip model may require the support of new technologies, depending on the specific technologies needed. For example, if a device needs to be able to process large amounts of data quickly, then it may require the use of advanced algorithms and hardware accelerators. Additionally, if the device needs to be able to communicate with other devices, then it may require the use of wireless technologies such as Bluetooth or Wi-Fi.
Overall, the XC3S1500-5FG676I chip model is a powerful and reliable device that is well-suited for a variety of applications. Its low cost and versatile capabilities make it an attractive choice for those who need a reliable and powerful device. Its high demand in the future is expected to be driven by its ability to meet the needs of a wide range of applications, as well as its ability to support emerging technologies. Finally, the device may require the support of new technologies, depending on the specific technologies needed.
5,581 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $262.1451 | $262.1451 |
| 10+ | $259.3263 | $2,593.2629 |
| 100+ | $245.2325 | $24,523.2468 |
| 1000+ | $231.1386 | $115,569.3240 |
| 10000+ | $211.4073 | $211,407.3000 |
| The price is for reference only, please refer to the actual quotation! | ||