AMD Xilinx
XC3S1500-5FG456I
XC3S1500-5FG456I ECAD Model
XC3S1500-5FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 333 | |
| Number of Outputs | 333 | |
| Number of Logic Cells | 29952 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 3328 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3328 CLBS, 1500000 GATES | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 2.60 MM HEIGHT, 1 MM PITCH, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S1500-5FG456I Datasheet Download
XC3S1500-5FG456I Overview
The XC3S1500-5FG456I chip model is a powerful and versatile integrated circuit that has been widely used in a variety of industries. As a leading model in the field of programmable logic devices, it has been widely used in fields such as industrial automation, aerospace, communications, and medical equipment. It is equipped with advanced features such as high-speed logic, low power consumption, and a wide range of compatible devices.
In the future, the XC3S1500-5FG456I chip model is expected to remain popular in many industries. With the development of new technologies, the applications of the chip model will be further expanded. For example, as the development of 5G networks continues to progress, the chip model will be used in more wireless communication applications. In addition, with the development of AI technology, the chip model is expected to be used in more intelligent scenarios such as autonomous driving and intelligent robots.
In terms of the application environment, the XC3S1500-5FG456I chip model can support a variety of new technologies. It is compatible with a range of operating systems, including Linux, Windows, and Android. It also supports a wide range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. Furthermore, the chip model is also capable of supporting new technologies such as artificial intelligence, machine learning, and blockchain.
In conclusion, the XC3S1500-5FG456I chip model is a powerful and versatile integrated circuit that has been widely used in a variety of industries. With the development of new technologies, the applications of the chip model will be further expanded, and it is expected to remain popular in many industries in the future. It is also capable of supporting a variety of new technologies, making it suitable for use in the era of fully intelligent systems.
4,030 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $169.5260 | $169.5260 |
| 10+ | $167.7031 | $1,677.0312 |
| 100+ | $158.5888 | $15,858.8820 |
| 1000+ | $149.4745 | $74,737.2600 |
| 10000+ | $136.7145 | $136,714.5000 |
| The price is for reference only, please refer to the actual quotation! | ||