XC3190A-3PP175I
XC3190A-3PP175I
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rohs

AMD Xilinx

XC3190A-3PP175I


XC3190A-3PP175I
F20-XC3190A-3PP175I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, PGA-175
PLASTIC, PGA-175

XC3190A-3PP175I ECAD Model


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XC3190A-3PP175I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 144
Number of Outputs 144
Number of Logic Cells 320
Number of Equivalent Gates 5000
Number of CLBs 320
Combinatorial Delay of a CLB-Max 2.7 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature MAX USABLE 6000 LOGIC GATES
Clock Frequency-Max 270 MHz
Power Supplies 5 V
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PPGA-P175
Qualification Status Not Qualified
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 175
Package Body Material PLASTIC/EPOXY
Package Code HPGA
Package Equivalence Code PGA175,16X16
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount NO
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 42.164 mm
Length 42.164 mm
Seated Height-Max 4.191 mm
Ihs Manufacturer XILINX INC
Package Description PLASTIC, PGA-175
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Part Package Code PGA
Pin Count 175

XC3190A-3PP175I Datasheet Download


XC3190A-3PP175I Overview



The XC3190A-3PP175I chip model is a powerful and reliable digital signal processor that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed for use with HDL (Hardware Description Language) languages, allowing for the development of complex and sophisticated systems.


This chip model is capable of providing high-performance processing capabilities, as well as a wide range of features. It is capable of handling large amounts of data, and its architecture is designed to be both efficient and reliable. It is also capable of providing a high degree of accuracy, allowing for precise and reliable results.


The XC3190A-3PP175I chip model has been used in a variety of applications, including medical imaging, industrial automation, and other areas. It has also been used in the development of intelligent robots, providing high-performance computing capabilities and allowing for the development of sophisticated and reliable systems.


The XC3190A-3PP175I chip model also provides a range of features that allow for the development of complex and sophisticated systems. It is capable of providing a high degree of accuracy, allowing for precise and reliable results. It also provides a range of features that allow for the development of complex and sophisticated systems.


In order to effectively use the XC3190A-3PP175I chip model, it is important to have a good understanding of the HDL language and its capabilities. It is also important to have a good understanding of the design requirements of the chip model, as well as the actual case studies and precautions associated with its use. Furthermore, it is important to have a good understanding of the features and capabilities of the chip model, and how it can be applied in the development and popularization of future intelligent robots.


Overall, the XC3190A-3PP175I chip model is a powerful and reliable digital signal processor that is suitable for a variety of applications. It is designed for use with HDL languages, allowing for the development of complex and sophisticated systems. It is capable of providing a high degree of accuracy, allowing for precise and reliable results. In order to effectively use the XC3190A-3PP175I chip model, it is important to have a good understanding of the HDL language and its capabilities, as well as the design requirements of the chip model, the actual case studies, and the precautions associated with its use. Furthermore, it is important to have a good understanding of the features and capabilities of the chip model, and how it can be applied in the development and popularization of future intelligent robots.



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