AMD Xilinx
XC3190A-2PP175C
XC3190A-2PP175C ECAD Model
XC3190A-2PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PLASTIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-2PP175C Datasheet Download
XC3190A-2PP175C Overview
The Xilinx XC3190A-2PP175C chip model is a high-performance field programmable gate array (FPGA) designed for digital signal processing, embedded processing, and image processing applications. It is an ideal solution for applications that require high-speed, low-power, and reliable performance. The XC3190A-2PP175C is programmed using the hardware description language (HDL) and includes a range of features that enable it to process data quickly and accurately.
The XC3190A-2PP175C chip model is designed to provide high-performance signal processing capabilities, allowing it to be used in a wide range of applications. It is suitable for applications such as video, audio, and image processing, as well as high-speed communication systems. The chip model also provides a high level of flexibility, allowing users to make changes to the design without having to re-program the entire system.
The XC3190A-2PP175C chip model is designed with scalability in mind, allowing it to be used in a wide range of applications. It is designed to support multiple clock speeds, as well as multiple I/O interfaces. The chip model also features a range of features that allow it to be used for advanced communication systems, such as high-speed Ethernet and Fibre Channel.
The XC3190A-2PP175C chip model is designed to provide users with the flexibility to upgrade their designs as technology advances. The chip model includes a range of features that can be used to increase the performance and capabilities of the system. This includes the ability to add new features, such as additional memory or improved performance, as well as the ability to upgrade the system to use the latest technologies.
The XC3190A-2PP175C chip model is designed to provide users with the flexibility to upgrade their designs as technology advances. The chip model includes a range of features that can be used to increase the performance and capabilities of the system. This includes the ability to add new features, such as additional memory or improved performance, as well as the ability to upgrade the system to use the latest technologies.
The XC3190A-2PP175C chip model is designed to provide users with the flexibility to upgrade their designs as technology advances. The chip model includes a range of features that can be used to increase the performance and capabilities of the system. This includes the ability to add new features, such as additional memory or improved performance, as well as the ability to upgrade the system to use the latest technologies.
The XC3190A-2PP175C chip model is an ideal solution for those looking for high-performance digital signal processing, embedded processing, and image processing applications. It is designed with scalability in mind, allowing it to be used in a wide range of applications. The chip model also provides a high level of flexibility, allowing users to make changes to the design without having to re-program the entire system. The chip model is also designed to support multiple clock speeds, as well as multiple I/O interfaces, making it suitable for advanced communication systems. It is expected that demand for this chip model will continue to grow in the future, as its features and capabilities make it a popular choice for a wide range of applications.
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