AMD Xilinx
XC3190A-1PP175C
XC3190A-1PP175C ECAD Model
XC3190A-1PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 1.75 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PLASTIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3190A-1PP175C Datasheet Download
XC3190A-1PP175C Overview
The XC3190A-1PP175C chip model has become a major player in the chip industry, and its application in various fields is increasing. As the demand for more advanced technologies continues to grow, the XC3190A-1PP175C chip model has become a popular choice for those looking to make their projects more efficient.
The XC3190A-1PP175C chip model is a high-performance, low-power device that is designed to support a wide range of applications. It is a multi-core processor that is designed to handle complex tasks quickly and efficiently. The chip model is also highly compatible with a variety of operating systems, making it ideal for use in embedded systems.
In addition to its performance and power efficiency, the XC3190A-1PP175C chip model also offers a number of advantages that make it an attractive choice for those in the industry. For instance, the chip model is designed to be cost-effective, making it suitable for a wide range of projects. It also has a low learning curve, making it easy to use and understand.
The XC3190A-1PP175C chip model is expected to become increasingly popular in the future, as more and more applications require its capabilities. This includes the development and popularization of future intelligent robots, which will require the chip model to be able to handle complex tasks quickly and efficiently.
In order to make full use of the XC3190A-1PP175C chip model, it is important to have the right technical talents in place. This includes those with experience in embedded systems and programming, as well as those with knowledge of the chip model itself. Having the right technical skills will ensure that the chip model is used effectively and efficiently, and that the benefits of the chip model are fully realized.
Overall, the XC3190A-1PP175C chip model is an excellent choice for those looking to make their projects more efficient and cost-effective. It is a powerful, low-power device that is designed to handle complex tasks quickly and efficiently. It is expected to become increasingly popular in the future, as more and more applications require its capabilities. In order to make full use of the chip model, it is important to have the right technical talents in place. With the right technical skills, the chip model can be used effectively and efficiently, allowing for the full potential of the chip model to be realized.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||