AMD Xilinx
XC3190A-09TQ176C
XC3190A-09TQ176C ECAD Model
XC3190A-09TQ176C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 370 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G176 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 176 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 24 mm | |
| Length | 24 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-176 | |
| Pin Count | 176 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3190A-09TQ176C Datasheet Download
XC3190A-09TQ176C Overview
The Xilinx XC3190A-09TQ176C chip model is an advanced FPGA (Field Programmable Gate Array) that is capable of high-performance computing, and is ideal for applications in communication systems. It is designed to provide the flexibility, scalability, and performance required by today’s most demanding applications.
The XC3190A-09TQ176C chip model is based on the Xilinx Virtex-4 architecture and is designed to provide the highest performance and scalability for embedded systems. It is designed with a low-power architecture, allowing for high-speed operation with minimal power consumption. It also features a high-speed serial interface, allowing for fast data transfer between devices.
The XC3190A-09TQ176C chip model is designed with the latest technology, making it highly reliable and efficient. It is capable of supporting multiple applications, such as high-speed data transfer, digital signal processing, and high-speed communications. It is also capable of supporting advanced communication systems, such as wireless networks, satellite communications, and cellular networks.
The XC3190A-09TQ176C chip model is also designed to be easily upgradeable. This allows users to upgrade the chip model with new features and capabilities as they become available. This allows users to keep up with the latest technologies and stay ahead of the competition.
The XC3190A-09TQ176C chip model can also be used in the development and popularization of future intelligent robots. It is designed with the latest technology and can be used to create robots that are capable of performing complex tasks. It is also designed to be easily integrated into existing robotic systems, allowing for the development of more advanced robots.
Using the XC3190A-09TQ176C chip model effectively requires the use of technical talents. It is important to understand the chip model's architecture, design, and programming capabilities in order to use it effectively. It is also important to understand the different applications and communication systems that the chip model is capable of supporting.
In conclusion, the XC3190A-09TQ176C chip model is an advanced FPGA designed to provide the highest performance and scalability for embedded systems. It is designed with the latest technology, making it highly reliable and efficient. It is capable of supporting multiple applications, such as high-speed data transfer, digital signal processing, and high-speed communications. It is also capable of supporting advanced communication systems, such as wireless networks, satellite communications, and cellular networks. It is also designed to be easily upgradeable, allowing users to keep up with the latest technologies and stay ahead of the competition. Finally, it can be used in the development and popularization of future intelligent robots, although using it effectively requires the use of technical talents.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||