AMD Xilinx
XC3120-3PC68C
XC3120-3PC68C ECAD Model
XC3120-3PC68C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PLASTIC, LCC-68 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | LCC | |
| Pin Count | 68 |
XC3120-3PC68C Datasheet Download
XC3120-3PC68C Overview
The chip model XC3120-3PC68C is a high-performance, low-power, and low-cost chip model developed by Xilinx. It is a single-chip solution that integrates multiple functions such as ARM Cortex-A9 processor, memory controller, and digital signal processor (DSP). This chip model can be used in a wide range of applications such as communications, industrial automation, medical, automotive, and consumer electronics.
In terms of industry trends, the XC3120-3PC68C chip model is expected to become the mainstream in the future. With the development of 5G and artificial intelligence (AI) technology, the demand for high-performance, low-power, and low-cost chip models is increasing. The XC3120-3PC68C chip model is perfectly suited to meet this demand. It can be used in 5G base stations, edge computing, and AI applications.
In terms of the original design intention of the chip model XC3120-3PC68C and the possibility of future upgrades, the chip model is designed to be highly scalable. It can be upgraded to support new technologies such as 5G, AI, and edge computing. This makes it an ideal choice for applications that require the support of new technologies.
In terms of future applications, the XC3120-3PC68C chip model can be used in networks such as 5G base stations, edge computing, and AI applications. It can also be used in intelligent scenarios such as smart homes, autonomous vehicles, and industrial automation. It is also possible to use the chip model in the era of fully intelligent systems, as it is highly scalable and can be upgraded to support new technologies.
Overall, the XC3120-3PC68C chip model is an ideal choice for applications that require high performance, low power, and low cost. It is highly scalable and can be upgraded to support new technologies. It can be used in a wide range of applications such as communications, industrial automation, medical, automotive, and consumer electronics. It is also suitable for use in networks and intelligent scenarios, as well as in the era of fully intelligent systems.
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5,021 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5.5800 | $5.5800 |
| 10+ | $5.5200 | $55.2000 |
| 100+ | $5.2200 | $522.0000 |
| 1000+ | $4.9200 | $2,460.0000 |
| 10000+ | $4.5000 | $4,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||