AMD Xilinx
XC3090A-7PP175C
XC3090A-7PP175C ECAD Model
XC3090A-7PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PLASTIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090A-7PP175C Datasheet Download
XC3090A-7PP175C Overview
The XC3090A-7PP175C chip model is a highly advanced integrated circuit that has been designed to meet the ever-growing demands of the modern world. It is a powerful and versatile chip that can be used in a variety of applications, ranging from networking to intelligent scenarios.
The XC3090A-7PP175C chip model is a 7-pin package that has a wide range of features. It is designed to provide high performance, low power consumption, and reliable operation. It has been designed to be compatible with a variety of technologies, such as Ethernet, Wi-Fi, Bluetooth, and more. It is also capable of supporting multiple operating systems, such as Windows, Linux, and Mac OS.
The XC3090A-7PP175C chip model is capable of providing a high level of performance and reliability. It is capable of supporting a wide range of applications, including high-speed data transfer, network security, and intelligent scenarios. It is also capable of supporting multiple operating systems, such as Windows, Linux, and Mac OS.
The XC3090A-7PP175C chip model is capable of providing a high level of performance and reliability. It is designed to be compatible with a variety of technologies, such as Ethernet, Wi-Fi, Bluetooth, and more. It is also capable of supporting multiple operating systems, such as Windows, Linux, and Mac OS.
The XC3090A-7PP175C chip model is designed to be used in the era of fully intelligent systems. It is capable of providing a high level of performance and reliability. It is capable of supporting a wide range of applications, including high-speed data transfer, network security, and intelligent scenarios. It is also capable of supporting multiple operating systems, such as Windows, Linux, and Mac OS.
When it comes to industry trends for the XC3090A-7PP175C chip model, it is important to understand the specific design requirements and product descriptions. The chip model is designed to be compatible with a variety of technologies, such as Ethernet, Wi-Fi, Bluetooth, and more. Additionally, it is important to consider the actual case studies and precautions that are necessary when using the chip model.
In conclusion, the XC3090A-7PP175C chip model is a powerful and versatile chip that can be used in a variety of applications, ranging from networking to intelligent scenarios. It is designed to provide high performance, low power consumption, and reliable operation. It is capable of supporting a wide range of applications, including high-speed data transfer, network security, and intelligent scenarios. Additionally, it is capable of supporting multiple operating systems, such as Windows, Linux, and Mac OS. It is important to understand the specific design requirements and product descriptions, as well as the actual case studies and precautions that are necessary when using the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||