AMD Xilinx
XC3090-70PP175C
XC3090-70PP175C ECAD Model
XC3090-70PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.937 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PLASTIC, PGA-175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | PGA | |
| Pin Count | 175 |
XC3090-70PP175C Datasheet Download
XC3090-70PP175C Overview
The XC3090-70PP175C is a state-of-the-art chip model that is designed for a variety of high-performance applications including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is an acronym for Hardware Description Language. This language is used to create a hardware description of the chip model and is used to interface with other hardware components.
The original design intention of the XC3090-70PP175C was to provide a high-performance solution for digital signal processing, embedded processing, and image processing. It is designed to be highly efficient and reliable, and it is capable of handling large amounts of data quickly and accurately. Additionally, the chip model is designed to be easily upgradable, so that it can be used for more advanced applications in the future.
When it comes to the product description and specific design requirements of the XC3090-70PP175C, it is important to note that it is designed to be used with the HDL language. This language is used to create a hardware description of the chip model and is used to interface with other hardware components. Additionally, the chip model is designed to be highly efficient and reliable, and it is capable of handling large amounts of data quickly and accurately.
The XC3090-70PP175C is also capable of being applied to advanced communication systems. It is designed to be highly efficient and reliable, and it is capable of handling large amounts of data quickly and accurately. Additionally, the chip model is designed to be easily upgradable, so that it can be used for more advanced applications in the future.
When it comes to actual case studies and precautions related to the XC3090-70PP175C, it is important to note that it is designed to be highly efficient and reliable, and it is capable of handling large amounts of data quickly and accurately. Additionally, the chip model is designed to be easily upgradable, so that it can be used for more advanced applications in the future. Furthermore, it is important to note that the chip model should be used in accordance with the manufacturer's instructions and guidelines to ensure proper operation and functionality.
In conclusion, the XC3090-70PP175C is a state-of-the-art chip model that is designed for a variety of high-performance applications including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is an acronym for Hardware Description Language. Additionally, the chip model is designed to be highly efficient and reliable, and it is capable of handling large amounts of data quickly and accurately. Furthermore, it is capable of being applied to advanced communication systems, and it is designed to be easily upgradable, so that it can be used for more advanced applications in the future. It is important to note that the chip model should be used in accordance with the manufacturer's instructions and guidelines to ensure proper operation and functionality.
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3,756 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $40.1760 | $40.1760 |
| 10+ | $39.7440 | $397.4400 |
| 100+ | $37.5840 | $3,758.4000 |
| 1000+ | $35.4240 | $17,712.0000 |
| 10000+ | $32.4000 | $32,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||