AMD Xilinx
XC3020-70PC68C
XC3020-70PC68C ECAD Model
XC3020-70PC68C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 4.445 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-68 | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3020-70PC68C Datasheet Download
XC3020-70PC68C Overview
The chip model XC3020-70PC68C is an advanced integrated circuit (IC) device designed to meet the needs of modern communication systems. It is a highly integrated and cost-effective solution that enables users to create reliable and efficient wireless networks. This chip model is manufactured by Xilinx, a world leader in semiconductor technology and is used in many applications, including industrial automation, automotive, and consumer electronics.
The XC3020-70PC68C chip model is designed to provide a low power, high performance solution for a wide range of communication systems. It is a single-chip solution that integrates a wide range of functions, including digital signal processing, analog-to-digital conversion, and radio frequency (RF) transceiver. In addition, the chip model supports multiple protocols, such as Wi-Fi, Bluetooth, and ZigBee, and can be used in a variety of applications, such as mobile phones, medical devices, and industrial automation.
In terms of industry trends, the XC3020-70PC68C chip model is expected to continue to be a popular choice for communication systems due to its low power consumption, high performance, and wide range of features. As communication systems become more complex and require more features, the XC3020-70PC68C chip model will become increasingly important in providing the necessary support. As such, the market for this chip model is expected to grow in the coming years.
In terms of future upgrades, the XC3020-70PC68C chip model is designed to be easily upgradeable. It is built on a modular architecture that allows for the addition of new features and technologies as needed. This makes it a great choice for applications that require the support of new technologies, as it can be easily upgraded to meet the demands of the application.
When it comes to product description and specific design requirements, the XC3020-70PC68C chip model is a highly integrated solution that combines a wide range of features and technologies. It is designed to provide a low power, high performance solution for a wide range of communication systems. It supports multiple protocols, such as Wi-Fi, Bluetooth, and ZigBee, and can be used in a variety of applications, such as mobile phones, medical devices, and industrial automation.
In addition, there are a few important precautions to keep in mind when using the XC3020-70PC68C chip model. For example, it is important to ensure that the chip model is correctly configured and that all components are properly connected. Additionally, it is important to ensure that the chip model is not exposed to extreme temperatures or electrical interference.
The XC3020-70PC68C chip model is a great choice for those looking for a reliable, efficient, and cost-effective solution for their communication systems. With its low power consumption, high performance, and wide range of features, it is expected to remain a popular choice for communication systems in the future. In addition, its modular architecture allows for the easy addition of new features and technologies as needed, making it a great choice for applications that require the support of new technologies.
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3,921 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11.0112 | $11.0112 |
| 10+ | $10.8928 | $108.9280 |
| 100+ | $10.3008 | $1,030.0800 |
| 1000+ | $9.7088 | $4,854.4000 |
| 10000+ | $8.8800 | $8,880.0000 |
| The price is for reference only, please refer to the actual quotation! | ||