AMD Xilinx
XC2VPX20-7FFG896C
XC2VPX20-7FFG896C ECAD Model
XC2VPX20-7FFG896C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 2448 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2448 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VPX20-7FFG896C Datasheet Download
XC2VPX20-7FFG896C Overview
The XC2VPX20-7FFG896C chip model is a highly advanced model that has been developed to meet the growing demands of the industry. It is a new generation of FPGA (Field Programmable Gate Array) that is designed to provide high-performance computing and networking solutions. This model is capable of providing high-speed data transfer, high-performance computing, and low-power consumption. It is also designed to be highly reliable and robust, making it suitable for a wide range of applications.
In terms of industry trends, the XC2VPX20-7FFG896C chip model is expected to be in high demand in the coming years. This is due to its ability to provide high-performance computing and networking solutions, as well as its low-power consumption. This model is also expected to be a popular choice for networks and other intelligent scenarios due to its high-speed data transfer capabilities.
The XC2VPX20-7FFG896C chip model is also expected to be a popular choice for the future of intelligent systems. This is due to its ability to provide high-speed data transfer and low-power consumption. This model is also expected to be able to support new technologies as the industry progresses, making it suitable for the era of fully intelligent systems.
In conclusion, the XC2VPX20-7FFG896C chip model is a highly advanced model that is designed to provide high-performance computing and networking solutions. This model is expected to be in high demand in the coming years due to its ability to provide high-speed data transfer, high-performance computing, and low-power consumption. It is also expected to be a popular choice for networks and other intelligent scenarios, as well as for the future of intelligent systems. Therefore, it is possible that the XC2VPX20-7FFG896C chip model may be used in the era of fully intelligent systems, depending on what specific technologies are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||