
AMD Xilinx
XC2VP7-6FFG896I
XC2VP7-6FFG896I ECAD Model
XC2VP7-6FFG896I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 396 | |
Number of Outputs | 396 | |
Number of Logic Cells | 11088 | |
Number of CLBs | 1232 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1232 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B896 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 896 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA896,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA896,30X30,40 | |
Pin Count | 896 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2VP7-6FFG896I Datasheet Download
XC2VP7-6FFG896I Overview
The chip model XC2VP7-6FFG896I is a cutting-edge technology developed by Xilinx Corporation. It is a field-programmable gate array (FPGA) chip that incorporates a range of advanced features, including a high-speed, low-power design and a wide range of configurable options. This chip model is designed to provide high-speed data processing and reliable performance in a wide range of applications.
In terms of industry trends, the chip model XC2VP7-6FFG896I is expected to be a popular choice for many industries, including communication systems, robotics, and artificial intelligence. The chip model is expected to be used in the development and popularization of future intelligent robots, where it will be used to process data quickly and efficiently.
In terms of future development, the chip model XC2VP7-6FFG896I is expected to be upgraded with new technologies and features to keep up with the ever-changing demands of the market. The chip model is designed to be flexible and versatile, allowing users to configure the chip to their specific needs. It is also designed to be compatible with a range of advanced communication systems, allowing for the development and deployment of new technologies.
In terms of whether the application environment requires the support of new technologies, this depends on the specific technologies required. The chip model XC2VP7-6FFG896I is designed to be compatible with a wide range of technologies, and it can be used to support a variety of applications. However, it is important to note that the chip model may not be able to support all of the technologies required for a particular application.
Finally, in terms of the technical talents needed to use the chip model XC2VP7-6FFG896I effectively, it is important to note that the chip model is designed for experienced professionals. Those who are familiar with the chip model will be able to configure it to their specific needs and take advantage of its advanced features. Those who are unfamiliar with the chip model should consider taking a course or seeking out professional help to ensure that they are able to use the chip model effectively.
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2,212 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $408.4560 | $408.4560 |
10+ | $404.0640 | $4,040.6400 |
100+ | $382.1040 | $38,210.4000 |
1000+ | $360.1440 | $180,072.0000 |
10000+ | $329.4000 | $329,400.0000 |
The price is for reference only, please refer to the actual quotation! |