AMD Xilinx
XC2VP50-7BF957C
XC2VP50-7BF957C ECAD Model
XC2VP50-7BF957C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 5648 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5648 CLBS | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1.27 MM PITCH, FLIP CHIP, FBGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP50-7BF957C Datasheet Download
XC2VP50-7BF957C Overview
The chip model XC2VP50-7BF957C is a powerful and versatile semiconductor device designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, which is a programming language used to describe the behavior of digital circuits.
The original design intention of the chip model XC2VP50-7BF957C was to provide a powerful and reliable solution for digital signal processing, embedded processing, and image processing. It is capable of performing a wide range of tasks, from basic operations to complex computations. It also offers the possibility of future upgrades, allowing users to keep up with the latest developments in technology.
The chip model XC2VP50-7BF957C can also be applied to advanced communication systems. It has the capability to handle high-speed data transmission, enabling users to create complex communication networks. It is also suitable for the development and popularization of future intelligent robots, as it can be used to control the robot’s movements and actions.
In order to use the chip model XC2VP50-7BF957C effectively, technical talents are needed. Those who are familiar with the HDL language, as well as the fundamentals of digital signal processing, embedded processing, and image processing, will be able to make the most out of the chip model. Furthermore, knowledge of advanced communication systems and robotics will be beneficial when using the chip model for these applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||