XC2VP50-6BF957C
XC2VP50-6BF957C
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rohs

AMD Xilinx

XC2VP50-6BF957C


XC2VP50-6BF957C
F20-XC2VP50-6BF957C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1.27 MM PITCH, FLIP CHIP, FBGA-957
1.27 MM PITCH, FLIP CHIP, FBGA-957

XC2VP50-6BF957C ECAD Model


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XC2VP50-6BF957C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of CLBs 5648
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 5648 CLBS
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B957
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 957
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1.27 MM PITCH, FLIP CHIP, FBGA-957
Pin Count 957
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VP50-6BF957C Datasheet Download


XC2VP50-6BF957C Overview


AMD Xilinx offers a wide range of electronic components for various applications, and one such component is the XC2VP50-6BF957C. This component can be purchased from FMALL, a reputable supplier of electronic components.

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