AMD Xilinx
XC2VP4-7FG256I
XC2VP4-7FG256I ECAD Model
XC2VP4-7FG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 140 | |
| Number of Outputs | 140 | |
| Number of Logic Cells | 6768 | |
| Number of CLBs | 752 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 752 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP4-7FG256I Datasheet Download
XC2VP4-7FG256I Overview
The XC2VP4-7FG256I chip model is a high-performance, versatile integrated circuit designed to meet the needs of digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language and is suitable for a wide range of applications.
The XC2VP4-7FG256I chip model is a highly efficient and cost-effective solution that can be used in a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It has been designed to be compatible with the HDL language, allowing designers to quickly and easily create complex systems.
The chip model XC2VP4-7FG256I is designed to be highly flexible and adaptable, with the ability to be upgraded in the future. This makes it suitable for a variety of applications, including advanced communication systems. The chip model is also capable of supporting new technologies, depending on the specific needs of the application environment.
The original design intention of the chip model XC2VP4-7FG256I was to provide a highly efficient, cost-effective solution for digital signal processing, embedded processing, and image processing. It is designed to be flexible and adaptable, allowing for future upgrades, and is capable of supporting new technologies.
The XC2VP4-7FG256I chip model is a versatile integrated circuit that is suitable for a wide range of applications, from high-performance digital signal processing to image processing. Its flexibility and adaptability make it suitable for advanced communication systems, and its compatibility with the HDL language allows designers to quickly and easily create complex systems. As the industry continues to evolve, the XC2VP4-7FG256I chip model will continue to be a versatile, cost-effective solution that can meet the needs of digital signal processing, embedded processing, and image processing.
2,673 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||