AMD Xilinx
XC2VP20-7FF896C
XC2VP20-7FF896C ECAD Model
XC2VP20-7FF896C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 556 | |
| Number of Outputs | 556 | |
| Number of Logic Cells | 20880 | |
| Number of CLBs | 2320 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2320 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA896,30X30,40 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2VP20-7FF896C Datasheet Download
XC2VP20-7FF896C Overview
The chip model XC2VP20-7FF896C has become increasingly popular in the market due to its advanced features and capabilities. This chip model is a high-performance, low-power, and economical solution for a variety of applications. It is a FPGA (Field Programmable Gate Array) that is designed to provide users with a flexible, efficient, and cost-effective solution. It is capable of handling a wide range of tasks, such as data processing, signal processing, and communication.
The XC2VP20-7FF896C chip model is designed to provide a low-power solution to a wide range of applications. It is designed to provide a high-performance solution while consuming minimal power. This chip model is designed to be compatible with a wide range of operating systems and platforms, making it a versatile solution for many applications. It is also designed to be reliable and provide a high-quality performance.
The XC2VP20-7FF896C chip model is equipped with a number of features that make it an ideal solution for many applications. It is designed to provide a low-cost and low-power solution for applications that require high-performance and reliability. It is also designed to be compatible with a wide range of operating systems and platforms, making it a versatile solution for many applications. Additionally, it is designed to be compatible with a wide range of development tools, making it easy to use for developers.
The XC2VP20-7FF896C chip model is expected to be in high demand in the future due to its advanced features and capabilities. It is expected to be used in a variety of applications, such as data processing, signal processing, and communication. Additionally, it is expected to be used in a variety of industrial applications, such as automotive, aerospace, and medical applications. Furthermore, it is expected to be used in a variety of consumer electronics, such as smartphones, tablets, and laptops.
When considering the application environment of the XC2VP20-7FF896C chip model, it is important to consider the specific technologies needed to support the application. For example, if the application requires a high-performance solution, then the chip model should be designed to support a wide range of high-performance technologies, such as high-speed data transfer, advanced signal processing, and advanced communication protocols. Additionally, if the application requires a low-power solution, then the chip model should be designed to support a wide range of low-power technologies, such as low-power memory and low-power processors.
In addition to considering the specific technologies needed to support the application, it is also important to consider the product description and specific design requirements of the XC2VP20-7FF896C chip model. It is important to consider the product description to ensure that the chip model is designed to meet the specific requirements of the application. Additionally, it is important to consider the specific design requirements to ensure that the chip model is designed to meet the specific requirements of the application. Additionally, it is important to consider actual case studies and precautions when using the chip model in order to ensure that it is used correctly and efficiently.
Overall, the XC2VP20-7FF896C chip model is a high-performance, low-power, and economical solution for a variety of applications. It is expected to be in high demand in the future due to its advanced features and capabilities. When considering the application environment of the XC2VP20-7FF896C chip model, it is important to consider the specific technologies needed to support the application, as well as the product description and specific design requirements. Additionally, it is important to consider actual case studies and precautions when using the chip model in order to ensure that it is used correctly and efficiently.
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2,238 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $831.7920 | $831.7920 |
| 10+ | $822.8480 | $8,228.4800 |
| 100+ | $778.1280 | $77,812.8000 |
| 1000+ | $733.4080 | $366,704.0000 |
| 10000+ | $670.8000 | $670,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||