AMD Xilinx
XC2VP100-7FFG1696C
XC2VP100-7FFG1696C ECAD Model
XC2VP100-7FFG1696C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 11024 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11024 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1696 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1696 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1696 | |
| Pin Count | 1696 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP100-7FFG1696C Datasheet Download
XC2VP100-7FFG1696C Overview
The chip model XC2VP100-7FFG1696C is an important component of the semiconductor industry and has been widely used in a variety of industries. As the industry trends and technology advances, the chip model XC2VP100-7FFG1696C is also evolving and adapting to the ever-changing application environment.
The XC2VP100-7FFG1696C chip model is a programmable logic device (PLD) designed and manufactured by Xilinx. It is a high-performance, low-cost, and low-power device, making it the ideal choice for a variety of applications. The chip model features 1696 logic cells, 4,096 RAM blocks, and two clock management tiles, making it a powerful and versatile device.
The chip model can be used in a variety of applications, including networking, embedded systems, and industrial automation. In the networking field, the chip model can be used to create high-performance network solutions, such as routers and switches. In embedded systems, the chip model can be used to create highly reliable and efficient solutions for a variety of applications, such as medical devices, automotive systems, and consumer electronics. In industrial automation, the chip model can be used to create high-performance solutions for controlling and monitoring industrial processes.
In addition, the chip model can be used in the era of fully intelligent systems. The chip model can be used to create intelligent solutions for a variety of scenarios, such as autonomous vehicles, artificial intelligence (AI), and robotics. The chip model can be used to create solutions that are capable of learning and adapting to their environment.
The design requirements of the chip model XC2VP100-7FFG1696C include a maximum operating frequency of 250 MHz and a maximum power consumption of 0.6 W. The chip model also features a variety of features and options, such as memory protection, enhanced security, and a wide range of I/O options.
When designing solutions with the chip model XC2VP100-7FFG1696C, it is important to consider the specific application requirements and the potential risks associated with the design. It is also important to consider the potential for future development and the need for new technologies in the application environment. It is also important to consider the potential for future applications and the need for new technologies in the application environment.
In conclusion, the chip model XC2VP100-7FFG1696C is a powerful and versatile device that can be used in a variety of applications. It is important to consider the specific application requirements and potential risks when designing solutions with the chip model. It is also important to consider the potential for future development and the need for new technologies in the application environment.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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