XC2V500-5FG256I
XC2V500-5FG256I
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AMD Xilinx

XC2V500-5FG256I


XC2V500-5FG256I
F20-XC2V500-5FG256I
Active
IC FPGA 172 I/O 256FBGA
256-FBGA (17x17)

XC2V500-5FG256I ECAD Model


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XC2V500-5FG256I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 768
Total RAM Bits 589824
Number of I/O 172
Number of Gates 500000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number XC2V500

XC2V500-5FG256I Datasheet Download


XC2V500-5FG256I Overview



The XC2V500-5FG256I is a field-programmable gate array (FPGA) device manufactured by Xilinx. This device is based on the Virtex-II Pro platform and is designed to provide high performance, low power consumption, and high density. It has a total of 5 million system gates, 256 I/O pins, and 256 Kbits of embedded block RAM. It also features Xilinx's Advanced System-level Design (ASLD) technology and supports up to three clock regions, allowing for high-speed clock distribution.


The XC2V500-5FG256I is suitable for a wide range of applications, including digital signal processing, embedded control, data acquisition, and communications. It is also suitable for applications that require high-speed, low-power, and high-density solutions. It is designed to be used in a variety of different systems, including industrial, automotive, and aerospace.


The XC2V500-5FG256I has a maximum operating frequency of 250 MHz and a maximum power dissipation of 4.5 W. It is also designed for a wide range of temperatures, from -40°C to +85°C. It is available in a variety of packages, including a fine-pitch BGA, a plastic BGA, and a ceramic BGA.


In summary, the XC2V500-5FG256I is a high-performance, low-power, and high-density FPGA device from Xilinx. It is suitable for a wide range of applications, including digital signal processing, embedded control, data acquisition, and communications. It has a maximum operating frequency of 250 MHz and a maximum power dissipation of 4.5 W. It is available in a variety of packages and is designed to operate in a wide range of temperatures.



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