AMD Xilinx
XC2V40-6FGG256C
XC2V40-6FGG256C ECAD Model
XC2V40-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-II | |
| Package | Tray | |
| Number of LABs/CLBs | 64 | |
| Total RAM Bits | 73728 | |
| Number of I/O | 88 | |
| Number of Gates | 40000 | |
| Voltage - Supply | 1.425V ~ 1.575V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Base Product Number | XC2V40 |
XC2V40-6FGG256C Datasheet Download
XC2V40-6FGG256C Overview
The XC2V40-6FGG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a highly versatile chip that can be used for a variety of applications.
The XC2V40-6FGG256C has a total of 256 I/O pins and is built using a 0.18 micron CMOS technology. It also has a total of 40,000 logic cells, which is suitable for a wide range of applications. The chip has a maximum operating frequency of 200MHz and a maximum power dissipation of 2.5W. It also has a maximum operating temperature of 85°C.
The XC2V40-6FGG256C is suitable for a wide range of applications such as embedded systems, communications, networking, automotive, aerospace, and industrial control. It is also suitable for applications such as digital signal processing, image processing, and video processing.
The XC2V40-6FGG256C is a cost-effective solution for many applications. It is also easy to program and configure, and can be used for a variety of applications. Its high performance and low power consumption make it an ideal choice for many applications.
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