
AMD Xilinx
XC2V1000-6FGG256C
XC2V1000-6FGG256C ECAD Model
XC2V1000-6FGG256C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 1280 | |
Total RAM Bits | 737280 | |
Number of I/O | 172 | |
Number of Gates | 1000000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FBGA (17x17) | |
Base Product Number | XC2V1000 |
XC2V1000-6FGG256C Datasheet Download
XC2V1000-6FGG256C Overview
The XC2V1000-6FGG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range device that provides a high level of integration, making it suitable for a wide range of applications.
The XC2V1000-6FGG256C is a 6-layer FPGA chip with 256K system gates. It has a total of 28,672 logic cells, including 24,576 4-input look-up tables (LUTs) and 4,096 flip-flops. It also has 4,096 RAM blocks, each with up to 18 Kbits of memory. The device has 32 dedicated 18x18 multipliers, and a wide range of I/O options, including LVDS, LVCMOS, and SSTL.
The XC2V1000-6FGG256C is suitable for a wide range of applications, including digital signal processing, embedded systems, communications, and networking. It has a high level of integration, making it suitable for applications that require a large number of features in a small package.
The device is also designed to be power efficient, with a maximum power consumption of just 4.8 watts. It is available in a range of packages, including a small, low-profile, lead-free package.
Overall, the XC2V1000-6FGG256C is a highly integrated and power-efficient FPGA chip, suitable for a wide range of applications. Its high level of integration and wide range of I/O options make it an ideal choice for many embedded and digital signal processing applications.
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