XC2V1000-6FGG256C
XC2V1000-6FGG256C
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AMD Xilinx

XC2V1000-6FGG256C


XC2V1000-6FGG256C
F20-XC2V1000-6FGG256C
Active
IC FPGA 172 I/O 256FBGA
256-FBGA (17x17)

XC2V1000-6FGG256C ECAD Model


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XC2V1000-6FGG256C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 1280
Total RAM Bits 737280
Number of I/O 172
Number of Gates 1000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number XC2V1000

XC2V1000-6FGG256C Datasheet Download


XC2V1000-6FGG256C Overview



The XC2V1000-6FGG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range device that provides a high level of integration, making it suitable for a wide range of applications.


The XC2V1000-6FGG256C is a 6-layer FPGA chip with 256K system gates. It has a total of 28,672 logic cells, including 24,576 4-input look-up tables (LUTs) and 4,096 flip-flops. It also has 4,096 RAM blocks, each with up to 18 Kbits of memory. The device has 32 dedicated 18x18 multipliers, and a wide range of I/O options, including LVDS, LVCMOS, and SSTL.


The XC2V1000-6FGG256C is suitable for a wide range of applications, including digital signal processing, embedded systems, communications, and networking. It has a high level of integration, making it suitable for applications that require a large number of features in a small package.


The device is also designed to be power efficient, with a maximum power consumption of just 4.8 watts. It is available in a range of packages, including a small, low-profile, lead-free package.


Overall, the XC2V1000-6FGG256C is a highly integrated and power-efficient FPGA chip, suitable for a wide range of applications. Its high level of integration and wide range of I/O options make it an ideal choice for many embedded and digital signal processing applications.



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